MEMS are intelligent, miniaturized 3D devices consisting of
microelectronic components (integrated circuits) and micromechanical,
optical, chemical, biochemical, or micro-optical components. MEMS
technology is a rapidly emerging field with a high growth rate. Motion
sensors, micro mirrors, microphones, gyroscopes, and accelerometers are
just a few of the MEMS devices that are found in consumer applications such
as cell phones, television sets, digital cameras, gaming devices and
laptops.
Many MEMS devices require silicon wafer bonding to create a first
level package - for example silicon or glass bonding - as a method to
hermetically seal and encapsulate the device. The EVG wafer bonding
systems are designed for volume manufacturing of MEMS and perform all wafer
bonding techniques utilizing EVG's unique process separation principle.
Various wafer sizes and materials with modular configurations for easy
transfer of R&D processes to production are supported. EVG's wafer
bonding equipment achieves the highest yields for aligned wafer bonding in
the industry.