Compound Semiconductors and Silicon-Based Power Devices

Microelectronic applications fabricated out of compound semiconductors as well as silicon-based power devices basically require dedicated manufacturing technologies offered by EVG.


CS International 2015
March 11 - 12, 2015, Sheraton Frankfurt Airport Hotel, Frankfurt, Germany
Visit us and our presentation about "Eliminating material boarders for heterogeneous integration through new wafer bonding processes" at the CS International Conference 2015.

SEMICON China 2015

SEMICON China 2015
March 17 - 19, 2015, Shanghai New International Expo Centre

Visit our booth # 3519 in Hall W3 at SEMICON China 2015 and our presentation at Sypmosium VII: Packaging and Assembly about "Wafer-Level 3D Integration by Low Temperature Wafer Bonding" at CSTIC 2015.


ArabLab 2015
March 23 - 26, 2015, Dubai International Convention & Exhibition Centre, Sheikh Saeed Halls 1, 2 & 3, Dubai, UAE

Visit us at booth # 588 at ArabLab 2015.