Microelectronic applications fabricated out of compound semiconductors as
well as silicon-based power devices basically require dedicated
manufacturing technologies offered by EVG.
Visit us and our presentation about "Heterogeneous integration enabled by advanced wafer bonding" at CS International 2016.
Visit us at SEMI ISS Europe 2016.
Visit us at booth #3519 at SEMICON China 2016 and visit our presentation "Wafer-Level Bonding for High-Vacuum MEMS Manufacturing" CSTIC.
Visit us at SEMICON Southeast Asia 2016.
EV Group Joins IRT Nanoelec 3D Integration Program
Korean National Nanofab Center Installs High-Vacuum Wafer Bonder from EV Group for Advanced MEMS Research and Foundry Services
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CS International 2016
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High Brightness LEDs
EV Group Corporate Video