LEDs, laser diodes and radio-frequency (RF) filters are examples of devices
based on compound semiconductors. Power devices like IGBTs, power MOSFETs
or diodes are microelectronic components that are essential functional
elements in electrical equipment such as voltage converters, power
amplifiers, switch-mode power supplies, etc. Out of EVG's technology
portfolio more or less all of EVG products are intesively used and
established within these markets.
As a prominent example, compound semiconductor manufacturing uses specific
techniques for processing thinned, fragile and often small diameter
substrates. For these applications, the EVG systems are equipped with
advanced features such as optical pre-alignment, backside alignment and
autoload with special end-effectors for reliable handling of delicate
substrates. The demand for temporary bonding is increasing with the use of
back-thinning and backside lithography in GaAs and other compound
semiconductor processes. For sensitive handling and safe processing of
fragile compound semiconductor wafers, EVG offers a
fully-automated
temporary bonding and debonding system. Compound semiconductor
wafers are bonded to sapphire, quartz or silicon carriers by use of dry
film, spin-on adhesives, or wax and can be debonded fully automatic
after backside processing is finished.
Silicon-based power devices are manufactured in large volumes and require
high-throughput reliable production equipment. As a major technology
advantage systems are equipped with a reliable robot handling system that
provides a high degree of automation. High uptime and ease of maintenance
contribute to increased performance and yield.