Advanced Packaging, 3D Interconnect

Wafer level packaging employs specific alignment and wafer bonding techniques as an enabling solution for stacking of wafers and three-dimensional integration of devices.


 
ectc15ECTC 2015
May 26 - 29, 2015, San Diego, CA, USA

Visit us at our booth # 206 and our presentation about "Influencing Factors in High Precision Fusion Wafer Bonding for Monolithic Integration" at ECTC 2015.

 


semiconrussiaSEMICON Russia 2015
June 17 - 18, 2015, Moscow, Russia

Visit booth # 301 at SEMICON Russia 2015.

 


Header_SEMI Packaging Tech SeminarSEMI Packaging Tech Seminar 2015
June 18, 2015, Vila do Conde, Portugal

Visit us at the SEMI Packaging Tech Seminar 2015.

 


iceptICEPT 2015
August 11 - 14, 2015, Changsha, China

Visit us at ICEPT 2015.

 


semicontwSEMICON Taiwan 2015
September 02 - 04, 2015, TWTC, Taipei, Taiwan

Visit us at booth # 706 at SEMICON Taiwan 2015.

 


semiconeuropaSEMICON Europa 2015
October 06 - 08, 2015, Dresden, Germany

Visit us at booth # 1324 at SEMICON Europa 2015