Wafer level packaging employs specific alignment and wafer bonding
techniques as an enabling solution for stacking of wafers and
three-dimensional integration of devices.
Visit us at booth #2 at EPTC 2015.
Meet us at the 3D ASIP Conference 2015.
Visit us at booth #5637 at SEMICON Japan 2015.
Visit us at booth #3 at the SEMI European 3D Summit 2016.
Visit us at booth #1440 at SEMICON Korea 2016.
Visit us at SEMI ISS Europe 2016.
Visit us at booth #3519 at SEMICON China 2016.
Visit our booth # 7 at ESTC 2016.
Advanced Packaging and 3D-IC Market driving strong growth for EV Group's automated 300-mm polymer adhesive wafer bonding systems
EV GROUP organizes Photonics Workshop in Conjunction with MICRO AND NANO ENGINEERING (MNE) Conference
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Nanotech ITALY 2015
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CMOS Image Sensors
Logic / Memory
Wafer Level Optics
EV Group and Fraunhofer IZM-ASSID Establish JDA for High-Volume 3D Integration Applications
EV Group Corporate Video