• Go to the main navigation
  • Go to content
 
EV Group
login
t-shop
  • EVGroup.com>>
  • Markets>>
  • Advanced Packaging, 3D Interconnect

Advanced Packaging, 3D Interconnect

Wafer level packaging employs specific alignment and wafer bonding techniques as an enabling solution for stacking of wafers and three-dimensional integration of devices.

Overview Applications Events Downloads


 



ECTC-63_logo

ECTC 2013
May 28 - 31, 2013, Las Vegas, NV USA
Visit us at booth # 406 at ECTC 2013.


scw13_web    

SEMICON West 2013
July 09 - 11, 2013, San Francisco, CA
Visit our booth # 819 at SEMICON West 2013.

Markets

  • Advanced Packaging, 3D Interconnect
  • Compound Semiconductor and Silicon-Based Power Devices
  • MEMS
  • Nanotechnology
  • SOI & Engineered Substrates
Advanced Product Search

News and Events

EV Group Rolls Out Next-Generation EVG120 Automated Resist Processing System

EV Group Ships 300mm Wafer Bonding System to Leading Chinese Semiconductor Foundry

more news ..

ECTC 2013

sensors expo & conference 2013

more events ..

TBDB_AD_Feb_13
See Also

Related Products

CMOS Image Sensors

Microfluidics

Logic / Memory

MEMS Devices

Wafer Level Optics

EV Group and Fraunhofer IZM-ASSID Establish JDA for High-Volume 3D Integration Applications

Technical Papers

Product Range

EV Group Corporate Video

3D InCites reports on EVG Headquarters expansion and technology developments

References

3D-logoincitesstrt2

3D InCites reports on EVG Headquarters expansion and technology developments

 
  • About
    • Vision/Mission
    • Awards
    • Certificates
    • Events
      • EVG Technology Days and Workshops
    • History
    • News
      • News Archive 2012
      • News Archive 2011
      • News Archive 2010
      • News Archive 2009
      • News Archive 2008
      • News Archive 2007
      • Picture Gallery
    • Purchasing
      • Demands
        • Mechanics
        • Electronics
        • Pneumatics
        • Fluidics
        • Vaccuum
        • Optical
      • Purchasing Conditions
      • Requirements
      • Purchasing Portal
    • Representatives & Industry Organizations
    • Environmental Policy
    • Overview
  • Products
    • Overview
    • Lithography
      • Mask Alignment Systems
        • EVG®610
        • EVG®620
        • EVG®620HBL Gen II
        • EVG®620NT
        • EVG®6200∞
        • EVG®6200NT
        • IQ Aligner®
      • Resist Processing Systems
        • EVG®101
        • EVG®101LA
        • EVG®105
        • EVG®120
        • EVG®150
        • EVG®150N
      • Lithography Track Systems
        • Hercules®
      • Nanoimprint Lithography Systems (UV-NIL, µCP, HE)
        • EVG®620
        • EVG®6200∞
        • IQ Aligner®
        • EVG®770
        • EVG®510HE
        • EVG®520HE
        • EVG®750
      • Inspection Systems
        • EVG®40
        • EVG®40NT
    • Bonding
      • Wafer Bonding Systems
        • EVG®501
        • EVG®510
        • EVG®520IS
        • EVG®540
        • EVG®540C2W
        • EVG®560
        • EVG®560HBL
      • Bond Alignment Systems
        • EVG®620
        • EVG®6200∞
        • SmartView®
        • SmartView®NT
      • Integrated Bonding Systems
        • Gemini®
        • GeminiFB®
      • SOI Bonding Systems
        • EVG®301
        • EVG®320
        • EVG®810LT
        • EVG®850
      • Temporary Bonding and Debonding Systems
        • EVG®805
        • EVG®850TB
        • EVG®850DB
        • EVG®820
        • ZoneBOND®
        • XT Frame Platform
      • Inspection Systems
        • EVG®20
        • EVG®40NT
    • Process Technology
  • Solutions
    • Overview
    • 3D IC
      • Introduction
      • Chip Stacking for 3D IC
      • Advanced C2W Bonding
      • Wafer Bonding for 3D IC
      • Thin Wafer Processing
        • Introduction
        • Tape Debonding
        • Thermal Slide Off Debonding
        • EVG® LowTemp™ ZoneBOND®
          • Introduction
          • Open Platform
    • CMOS Image Sensors
      • Introduction
      • Backend Lithography
      • Glass Bonding
      • Oxide Bonding
    • High Brightness LEDs
      • Introduction
      • Layer Transfer
      • Imprint Lithography
      • Optical Lithography
      • Thin Wafer Handling
    • Logic / Memory
      • Introduction
      • Backend Lithography
      • Wafer Level Bonding
      • C2W Bonding
      • Thin Wafer Handling
    • MEMS Devices
      • Introduction
      • Lithography
      • First Level Packaging
    • Microfluidics
      • Introduction
      • Hot Embossing
      • Wafer Level Bonding
    • SAW Devices
      • Introduction
      • Wafer Level Bonding
    • SOI Wafers
      • Introduction
      • Cleaning
      • Plasma Activation
      • Oxide Bonding
    • Wafer Level Optics
      • Introduction
      • Imprint Lithography
      • UV Bonding
    • Photovoltaics
      • Introduction
      • Imprint Lithography
      • Micro Optics
      • Wafer Bonding
      • Thin PV Wafers
      • Spray Coating
      • Optical Lithography
      • Anti-Reflective Coatings
  • Markets
    • Overview
    • Advanced Packaging, 3D Interconnect
    • Compound Semiconductor and Silicon-Based Power Devices
    • MEMS
    • Nanotechnology
    • SOI & Engineered Substrates
  • Services
    • Overview
    • Process Technology
    • Customer Support
      • Field-Service On-site Visits
      • Technical Support Call Center
      • Spare Parts
      • Product Improvements
      • Training
        • Training Request
      • Extended Equipment Warranty
      • Preventive Maintenance Agreement
      • On-site Service Agreement
  • Careers
  • Contact us
 
© EV Group, ALL RIGHTS RESERVED