Wafer level packaging employs specific alignment and wafer bonding
techniques as an enabling solution for stacking of wafers and
three-dimensional integration of devices.
Visit us at booth # 706 at SEMICON Taiwan 2015.
Visit us at booth # 1324 at SEMICON Europa 2015.
EV GROUP organizes Photonics Workshop in Conjunction with MICRO AND NANO ENGINEERING (MNE) Conference
EV Group Receives 3D InCites Award for GEMINI FB XT Automated Fusion Wafer Bonder
more news ..
SEMICON Taiwan 2015
SB Micro 2015
more events ..
CMOS Image Sensors
Logic / Memory
Wafer Level Optics
EV Group and Fraunhofer IZM-ASSID Establish JDA for High-Volume 3D Integration Applications
EV Group Corporate Video