Advanced Packaging, 3D Interconnect

Wafer level packaging employs specific alignment and wafer bonding techniques as an enabling solution for stacking of wafers and three-dimensional integration of devices.


 
theconfab-logo976x477ConFab 2017
May 14 - 17, 2017, Hotel del Coronado, San Diego, CA
Visit EVG at The ConFab 2017.

ECTC2017ECTC 2017
May 30 - June 02, 2017, Walt Disney World Swan and Dolphin Resort, Lake Buena Vista, FL
Visit our booth #405 at ECTC 2017.

semiconwestSEMICON West 2017
July 11 - 13, 2017, Moscone Center, San Francisco, CA
Visit our booth at SEMICON West 2017.

semiconeuropa_logoSEMICON Europa 2017
November 14 - 17, 2017, Messe München, Munich, Germany
Visit us at our booth #B1-1424 at SEMICON Europa 2017.