Advanced Packaging, 3D Interconnect

Wafer level packaging employs specific alignment and wafer bonding techniques as an enabling solution for stacking of wafers and three-dimensional integration of devices.


 

SEMICON Europa 

SEMICON Europa 2014
October 07 - 09, 2014, Alpexpo Grenoble, France

Visit our booth # 918 and our presentations at SEMICON Europa 2014.



impact
IMPACT 2014
Oct 22 - 24, 2014, Taipei, Taiwan
Visit our presentation at IMPACT 2014.

IWLPC2014_Logo-simpleIWLPC 2014
November 11 - 13, 2014, San Jose, CA
Visit us at IWLPC 2014.

3dasip3D Architectures for Semiconductor Integration and Packaging 2014
Dec 10 - 12, 2014, Burlingame, California