Advanced Packaging, 3D Interconnect

Wafer level packaging employs specific alignment and wafer bonding techniques as an enabling solution for stacking of wafers and three-dimensional integration of devices.


 
3D17_Header_Website_1920x300_161124SEMI European 3D Summit 2017
January 23 - 25, 2017, Grenoble, France
Visit our booth # 3 at the SEMI European 3D Summit 2017.


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SEMICON Korea 2017
February 08 - 10, 2017, COEX, Seoul, Korea
Visit our booth # 1650 at SEMICON Korea 2017.

imaps_4tierIMAPS Device Packaging 2017
March 07 - 09, 2017, Fountain Hills, Arizona, USA
Visit our booth at the IMAPS Device Packaging 2017.


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SEMICON China 2017
March 14 - 16, 2017, Shanghai New International Expo Centre, China
Visit our booth # 4663 in Hall W4 at SEMICON China 2017.