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EV Group meets the varied demands of diverse markets.

 

The basis for our success is our products: lithography, bonding and imprint systems. We hold the dominant share of the market for all types of wafer bonding equipment and are the market and technology leader in lithography and nanoimprinting.

Advanced Packaging, 3D Interconnect

Compound Semiconductor and Silicon-Based Power Devices

MEMS

Nanotechnology

SOI


Markets

  • Advanced Packaging, 3D Interconnect
  • Compound Semiconductor and Silicon-Based Power Devices
  • MEMS
  • Nanotechnology
  • SOI
Advanced Product Search

News and Events

EV Group Signs Collaboration Agreement with Eulitha

Asahi Kasei orders IQ Aligner UV-NIL system for advanced materials development for wafer-level optics

more news ..

Strategies in Light 2012

ICONN 2012

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Promotional Links

EV Group Solutions Video for 3D ICs and TSVs

EV Group Corporate Video

EV Group Corporate Brochure

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See Also

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2008 Advanced Packaging Award Winners At SEMICON West

 
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