EV Group Europe & Asia/Pacific GmbH
DI Erich Thallner Strasse 1
A-4782 St. Florian am Inn
Austria
Phone: +43 7712 5311 0
Fax: +43 7712 5311 4600
E-Mail: WebInfo@EVGroup.com
Chairman: DI Erich Thallner
Register Court Ried im Innkreis Austria
Handelsgericht A-4910 Ried i. I.
Handelsregister Nr. 316 392 h
Value added tax identification number ATU 64462708
About EV Group (EVG)
EV Group (EVG) is a world leader in wafer-processing solutions for
semiconductor, MEMS and nanotechnology applications. Through close
collaboration with its global customers, the company implements its
flexible manufacturing model to develop reliable, high-quality,
low-cost-of-ownership systems that are easily integrated into customers'
fab lines. Key products include wafer bonding,
lithography/nanoimprint lithography (NIL) and metrology equipment, as well
as photoresist coaters, cleaners and inspection systems. In addition to its
dominant share of the market for wafer bonders, EVG holds a leading
position in NIL and lithography for advanced packaging and MEMS.
Along these lines, the company co-founded the EMC-3D consortium in 2006 to
create and help drive implementation of a cost-effective
through-silicon-via (TSV) process for chip packaging and
MEMS/sensors. Other target semiconductor-related markets include
silicon-on-insulator (SOI), compound semiconductor and silicon-based
power-device solutions.Founded in 1980, EVG is headquartered in St.
Florian, Austria, and operates via a global customer support network, with
subsidiaries in Tempe, AZ.; Albany, NY; Yokohama and Fukuoka, Japan; Seoul,
Korea and Chung-Li, Taiwan. The company's unique Triple i-approach
(Invent - Innovate - Implement) is supported by a vertical integration,
allowing EVG to respond quickly to new technology developments, apply the
technology to manufacturing challenges and expedite device manufacturing in
high volume. More information is available at www.EVGroup.com.