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EV Group Inc.

United States

HR

EV Group Inc.
7700 South River Parkway
Tempe, AZ 85284
Phone: 1 480 305 2400
Fax: 1 480 305 2401
E-Mail

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News and Events

EVG and Dynaloy Jointly Develop Single-Wafer Cleaning Solution

Fraunhofer ISE Teams up with EVG to Enable Direct Semiconductor Wafer Bonds

more news ..

Photonics Festival 2013

intersolar North America 2013

more events ..

TBDB_AD_Feb_13
See Also

Careers

How to find EV Group North America (PDF)

Product Range

EV Group Corporate Video

3D InCites reports on EVG Headquarters expansion and technology developments

References

2013_RANKED1st_Logo_klein 
EVG wins 3 awards in VLSIresearch 2013 Customer Satisfaction Survey

 
  • About
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      • News Archive 2012
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    • Overview
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    • Overview
    • Lithography
      • Mask Alignment Systems
        • EVG®610
        • EVG®620
        • EVG®620HBL Gen II
        • EVG®620NT
        • EVG®6200∞
        • EVG®6200NT
        • IQ Aligner®
      • Resist Processing Systems
        • EVG®101
        • EVG®101LA
        • EVG®105
        • EVG®120
        • EVG®150
        • EVG®150N
      • Resist Stripping Systems
        • EVG®320RS
      • Lithography Track Systems
        • Hercules®
      • Nanoimprint Lithography Systems (UV-NIL, µCP, HE)
        • EVG®620
        • EVG®6200∞
        • IQ Aligner®
        • EVG®770
        • EVG®510HE
        • EVG®520HE
        • EVG®750
      • Inspection Systems
        • EVG®40
        • EVG®40NT
    • Bonding
      • Wafer Bonding Systems
        • EVG®501
        • EVG®510
        • EVG®520IS
        • EVG®540
        • EVG®540C2W
        • EVG®560
        • EVG®560HBL
      • Bond Alignment Systems
        • EVG®620
        • EVG®6200∞
        • SmartView®
        • SmartView®NT
      • Integrated Bonding Systems
        • Gemini®
        • GeminiFB®
      • SOI Bonding Systems
        • EVG®301
        • EVG®320
        • EVG®810LT
        • EVG®850
      • Temporary Bonding and Debonding Systems
        • EVG®805
        • EVG®850TB
        • EVG®850DB
        • EVG®820
        • ZoneBOND®
        • XT Frame Platform
      • Inspection Systems
        • EVG®20
        • EVG®40NT
    • Process Technology
  • Solutions
    • Overview
    • 3D IC
      • Introduction
      • Chip Stacking for 3D IC
      • Advanced C2W Bonding
      • Wafer Bonding for 3D IC
      • Thin Wafer Processing
        • Introduction
        • Tape Debonding
        • Thermal Slide Off Debonding
        • EVG® LowTemp™ ZoneBOND®
          • Introduction
          • Open Platform
    • CMOS Image Sensors
      • Introduction
      • Backend Lithography
      • Glass Bonding
      • Oxide Bonding
    • High Brightness LEDs
      • Introduction
      • Layer Transfer
      • Imprint Lithography
      • Optical Lithography
      • Thin Wafer Handling
    • Logic / Memory
      • Introduction
      • Backend Lithography
      • Wafer Level Bonding
      • C2W Bonding
      • Thin Wafer Handling
    • MEMS Devices
      • Introduction
      • Lithography
      • First Level Packaging
    • Microfluidics
      • Introduction
      • Hot Embossing
      • Wafer Level Bonding
    • SAW Devices
      • Introduction
      • Wafer Level Bonding
    • SOI Wafers
      • Introduction
      • Cleaning
      • Plasma Activation
      • Oxide Bonding
    • Wafer Level Optics
      • Introduction
      • Imprint Lithography
      • UV Bonding
    • Photovoltaics
      • Introduction
      • Imprint Lithography
      • Micro Optics
      • Wafer Bonding
      • Thin PV Wafers
      • Spray Coating
      • Optical Lithography
      • Anti-Reflective Coatings
  • Markets
    • Overview
    • Advanced Packaging, 3D Interconnect
    • Compound Semiconductor and Silicon-Based Power Devices
    • MEMS
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  • Careers
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