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EV Group Inc.

United States

HR

EV Group Inc.
7700 South River Parkway
Tempe, AZ 85284
Phone: 1 480 305 2400
Fax: 1 480 305 2401
E-Mail

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News and Events

EV Group Capitalizes on MEMS Market Leadership, Further Diversifies Business

EV Group Introduces Industry's First Fully Automated Wafer Bonding System for HB-LED Manufacturing

more news ..

NRW - Nano Conference 2010

SEMICON Taiwan 2010

more events ..

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Solutions for 3D Integration and TSV

EV Group Corporate Brochure

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How to find EV Group (PDF)

References

            30 years EVG

 
  • About
    • Vision/Mission
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    • Advertising
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    • History
    • 30th Anniversary
    • News
    • Purchasing
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        • Mechanics
        • Electronics
        • Pneumatics
        • Fluidics
        • Vaccuum
        • Optical
      • Purchasing Conditions
      • Requirements
    • Representatives & Industry Organizations
    • Environmental Policy
  • Products
    • Lithography
      • Mask Alignment Systems
        • EVG®610
        • EVG®620
        • EVG®620NT
        • EVG®6200∞
        • EVG®6200NT
        • IQ Aligner®
      • Resist Processing Systems
        • EVG®101
        • EVG®101LA
        • EVG®105
        • EVG®120
        • EVG®150
        • EVG®150N
      • Lithography Track Systems
        • Hercules®
      • Nanoimprint Lithography Systems (UV-NIL, µCP, HE)
        • EVG®620
        • EVG®6200∞
        • IQ Aligner®
        • EVG®770
        • EVG®510HE
        • EVG®520HE
        • EVG®750
      • Inspection Systems
        • EVG®40
        • EVG®40NT
    • Bonding
      • Wafer Bonding Systems
        • EVG®501
        • EVG®510
        • EVG®520IS
        • EVG®540
        • EVG®540C2W
        • EVG®560
        • EVG®560HBL
      • Bond Alignment Systems
        • EVG®620
        • EVG®6200∞
        • SmartView®
        • SmartView®NT
      • Integrated Bonding Systems
        • Gemini®
        • GeminiFB®
      • SOI Bonding Systems
        • EVG®301
        • EVG®320
        • EVG®810LT
        • EVG®850
      • Temporary Bonding and Debonding Systems
        • EVG®805
        • EVG®850TB
        • EVG®850DB
        • EVG®820
      • Inspection Systems
        • EVG®20
        • EVG®40NT
    • Process Technology
  • Solutions
    • CMOS Image Sensors
      • Introduction
      • Backend Lithography
      • Glass Bonding
      • Oxide Bonding
    • High Brightness LEDs
      • Introduction
      • Layer Transfer
      • Imprint Lithography
      • Optical Lithography
      • Thin Wafer Handling
    • Lab-on-Chip
      • Introduction
      • Hot Embossing
      • Wafer Level Bonding
    • Logic / Memory
      • Introduction
      • Backend Lithography
      • Wafer Level Bonding
      • C2W Bonding
      • Thin Wafer Handling
    • MEMS Devices
      • Introduction
      • Lithography
      • First Level Packaging
    • SAW Devices
      • Introduction
      • Wafer Level Bonding
    • SOI Wafers
      • Introduction
      • Cleaning
      • Plasma Activation
      • Oxide Bonding
    • Wafer Level Optics
      • Introduction
      • Imprint Lithography
      • UV Bonding
  • Markets
    • Advanced Packaging, 3D Interconnect
    • Compound Semiconductor and Silicon-Based Power Devices
    • MEMS
    • Nanotechnology
    • SOI
  • Services
    • Process Technology
    • Customer Support
      • Field-Service On-site Visits
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      • Spare Parts
      • Product Improvements
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      • Extended Equipment Warranty
      • Preventive Maintenance Agreement
      • On-site Service Agreement
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