• Go to the main navigation
  • Go to content
 
EV Group
login
t-shop
  • EVGroup.com>>
  • Contact us>>
  • Find your nearest contact
Back

EV Group Japan KK

Japan

HR

EV Group Japan KK
Yokohama Business Park East Tower 1F
134, Godo-cho, Hodogaya-ku, Yokohama-shi
KANAGAWA, 240-0005, Japan
TEL: +81 45 348 0665
FAX: +81 45 348 0666
E-Mail

Contact us

  • Sales contacts
  • Customer Support contacts
  • Find your nearest contact

News and Events

EV Group Capitalizes on MEMS Market Leadership, Further Diversifies Business

EV Group Introduces Industry's First Fully Automated Wafer Bonding System for HB-LED Manufacturing

more news ..

NRW - Nano Conference 2010

SEMICON Taiwan 2010

more events ..

Promotional Links

Solutions for 3D Integration and TSV

EV Group Corporate Brochure

Product Range

See Also

Careers

How to find EV Group (PDF)

References

            30 years EVG

 
  • About
    • Vision/Mission
    • Awards & Certificates
    • Advertising
    • Events
    • History
    • 30th Anniversary
    • News
    • Purchasing
      • Demands
        • Mechanics
        • Electronics
        • Pneumatics
        • Fluidics
        • Vaccuum
        • Optical
      • Purchasing Conditions
      • Requirements
    • Representatives & Industry Organizations
    • Environmental Policy
  • Products
    • Lithography
      • Mask Alignment Systems
        • EVG®610
        • EVG®620
        • EVG®620NT
        • EVG®6200∞
        • EVG®6200NT
        • IQ Aligner®
      • Resist Processing Systems
        • EVG®101
        • EVG®101LA
        • EVG®105
        • EVG®120
        • EVG®150
        • EVG®150N
      • Lithography Track Systems
        • Hercules®
      • Nanoimprint Lithography Systems (UV-NIL, µCP, HE)
        • EVG®620
        • EVG®6200∞
        • IQ Aligner®
        • EVG®770
        • EVG®510HE
        • EVG®520HE
        • EVG®750
      • Inspection Systems
        • EVG®40
        • EVG®40NT
    • Bonding
      • Wafer Bonding Systems
        • EVG®501
        • EVG®510
        • EVG®520IS
        • EVG®540
        • EVG®540C2W
        • EVG®560
        • EVG®560HBL
      • Bond Alignment Systems
        • EVG®620
        • EVG®6200∞
        • SmartView®
        • SmartView®NT
      • Integrated Bonding Systems
        • Gemini®
        • GeminiFB®
      • SOI Bonding Systems
        • EVG®301
        • EVG®320
        • EVG®810LT
        • EVG®850
      • Temporary Bonding and Debonding Systems
        • EVG®805
        • EVG®850TB
        • EVG®850DB
        • EVG®820
      • Inspection Systems
        • EVG®20
        • EVG®40NT
    • Process Technology
  • Solutions
    • CMOS Image Sensors
      • Introduction
      • Backend Lithography
      • Glass Bonding
      • Oxide Bonding
    • High Brightness LEDs
      • Introduction
      • Layer Transfer
      • Imprint Lithography
      • Optical Lithography
      • Thin Wafer Handling
    • Lab-on-Chip
      • Introduction
      • Hot Embossing
      • Wafer Level Bonding
    • Logic / Memory
      • Introduction
      • Backend Lithography
      • Wafer Level Bonding
      • C2W Bonding
      • Thin Wafer Handling
    • MEMS Devices
      • Introduction
      • Lithography
      • First Level Packaging
    • SAW Devices
      • Introduction
      • Wafer Level Bonding
    • SOI Wafers
      • Introduction
      • Cleaning
      • Plasma Activation
      • Oxide Bonding
    • Wafer Level Optics
      • Introduction
      • Imprint Lithography
      • UV Bonding
  • Markets
    • Advanced Packaging, 3D Interconnect
    • Compound Semiconductor and Silicon-Based Power Devices
    • MEMS
    • Nanotechnology
    • SOI
  • Services
    • Process Technology
    • Customer Support
      • Field-Service On-site Visits
      • Technical Support Call Center
      • Spare Parts
      • Product Improvements
      • Training
        • Training Request
      • Extended Equipment Warranty
      • Preventive Maintenance Agreement
      • On-site Service Agreement
  • Careers
    • HR Contacts
  • Contact us
 
© EV Group, ALL RIGHTS RESERVED