News Archive

Growth In Engineered Substrate Market For Power Device And Radio Frequency Applications Driving Demand For EV Group Wafer Bonding Solutions

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ST. FLORIAN , Austria, December 16, 2015 —EV Group (EVG) today announced that the company has seen a significant increase in demand for its wafer bonding solutions for engineered substrates over the past year. This rise in demand is driven in part by the rapid growth in the power electronics and radio frequency (RF) device markets - where engineered substrates offer key performance benefits, such as high carrier mobility and reduced power loss/leakage, due to their unique material properties.


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EVG received a Best in MEMS & Sensors Innovation (MEMsies) Award

Thumbnail_MEMS LogoST. FLORIAN, Austria, November 5, 2015 - During this year's MEMS Executive Congress hosted by the MEMS & Sensors Industry Group (MIG) in Napa Valley on November 4-6, EVG received a Best in MEMS & Sensors Innovation (MEMsies) Award for MEMS/Sensors Supplier of the Year.

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Advanced Packaging And 3D-IC Market Driving Strong Growth For EV Group’s Automated 300-mm Polymer Adhesive Wafer Bonding Systems

2015_08_EVG560_300mm_Thumbnail   ST. FLORIAN, Austria, August 31, 2015—EV Group (EVG) today announced that the company is experiencing strong demand for its automated 300-mm polymer adhesive wafer bonding systems. Over the past 12 months, the company’s order intake has doubled for these systems, including the EVG®560, GEMINI® and EVG®850 TB/DB series of wafer bonders. 

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EV GROUP organizes Photonics Workshop in Conjunction with MICRO AND NANO ENGINEERING (MNE) Conference  

MNE_ThumbnailST.FLORIAN, Austria, August 25, 2015 - EV Group (EVG) will host a special session at the 41st Micro and Nano Engineering (MNE 2015) conference – a leading international conference on micro- and nanofabrication and manufacturing using lithography and related techniques. The first EVG Photonics Workshop will take place at the World Forum in The Hague, The Netherlands, during the afternoon of the opening day of MNE 2015 on Monday, September 21.

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EV Group Receives 3D InCites Award for GEMINI FB XT Automated Fusion Wafer Bonder  

2015_07_3DIC_LogoST. FLORIAN, Austria, July 30, 2015-EV Group (EVG) today announced that it has received a 2015 3D InCites award for its GEMINI®FB XT automated fusion wafer bonder in the category of 3D manufacturing equipment. Hosted by 3D InCites, an online media resource founded in 2009 to stir up interest in 3D IC integration and 3D packaging technologies, the 3D InCites Awards program recognizes achievements to further the commercialization of 3D integration technologies.

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Leti and EVG Launch INSPIRE, a Lithography Program Aimed At Demonstrating Benefits of Nano-imprint Technology

2015_07_INSPIRE_ThumbnailGRENOBLE, France, and ST. FLORIAN AM INN, Austria - July 15, 2015 - CEA-Leti and EV Group have launched a new program in nano-imprint lithography (NIL) called INSPIRE to demonstrate the benefits of the versatile, powerful nano-patterning technology and spread its use for applications beyond semiconductors.

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EV Group Achieves Third Consecutive Triple Crown Win in 2015 VLSIresearch Customer Satisfaction Survey  

2015_05_VLSI_indexST. FLORIAN, AUSTRIA, July 14, 2015 - EV Group (EVG) announced that for a third year in a row, it has earned all three coveted awards from VLSIresearch's annual customer satisfaction survey. EVG has again been ranked as one of the 10 BEST Focused Chip Making Equipment Suppliers, as well as one of the 2015 THE BEST Suppliers of Fab Equipment. Additionally, EVG was distinguished with a 2015 RANKED 1st award in the Other Fab Equipment category.

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EV Group Ramps Nanoimprint Lithography into High-Volume Manufacturing with HERCULES® NIL Track System  

2015_07_HERCULES_NIL_ThumbnailST. FLORIAN, Austria, July 7, 2015-EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the HERCULES® NIL-a fully integrated track system that combines cleaning, resist coating and baking pre-processing steps with EVG's proprietary SmartNIL™ large-area nanoimprint lithography (NIL) process in a single platform.

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EV Group NILPhotonics™ Competence Center Sees Strong Customer Demand for Emerging Photonic Applications

201505_NILPhotonics_milestone 120px ST. FLORIAN, Austria, May 19, 2015-EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that its NILPhotonics™ Competence Center-established to assist customers in enabling new and enhanced products and applications in the field of photonics-has generated strong interest from customers and resulted in multiple system orders since its launch in December 2014.

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EV Group Extends Leadership in High-Vacuum Wafer Bonding Technology  

201503_EVG580-ComBond ST. FLORIAN, Austria, March 16, 2015-EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced two new configurations to its EVG®580 ComBond® series of automated high-vacuum covalent wafer bonding systems. Addressing the needs of universities and R&D institutes, and high-volume manufacturing (HVM) requirements, respectively, both system configurations achieve electrically conductive and oxide-free bonds of materials with different lattice constants and coefficients of thermal expansion at room temperature.

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