Localized Support to Address Increased Demand for 3D IC Process
Development in Asia Pacific
ST. FLORIAN, AUSTRIA and ROLLA, MO, January 7, 2009 - EV
Group (EVG) and Brewer Science, Inc., today announced the installation of
an EVG 500 series wafer-bonding system at Brewer Science's Taiwan
applications lab. Located in Hsinchu Science Park, this joint effort
offers customers timely localized support in the Asia-Pacific region for 3D
IC and other advanced process development programs. In a shared
commitment to speed commercialization of through-silicon via (TSV)
technology and enable the development of smaller, higher performance, and
more power-efficient electronic devices, this move is set to continue the
momentum of their joint development efforts.
In December 2007, EVG and Brewer Science announced ultra-thin wafer
handling capability for TSV creation to enable 3D chip stacking. This
joint development program continues efforts to provide a complete family of
ultra-thin wafer handling solutions to leading-edge CMOS image sensors,
DRAM, and integrated devices manufacturers, who demand wider temperature
range, thin wafer etching, passivation and metallization. To better
leverage their bonding and materials expertise and relationships in Taiwan,
the two companies now bring local bonding capability to technology
development teams for rapid process testing and development in the
"With Taiwan, and Asia Pacific generally, home to leading adopters of novel
processes such as TSV, the move to jointly manage customer process
development locally is a logical progression in advancing our partnership
efforts with Brewer Science," remarked Stefan Pargfrieder, EVG's business
development manager. "By leveraging Brewer Science's facility and
equipping them to handle temporary bonding demonstrations, it allows us to
have faster cycle times and a more centralized hands-on lab to collaborate
closely to adapt the process to our Asia-Pacific customers'
requirements." Pargfrieder concluded, "The addition of an
applications lab in Taiwan not only augments our network of global
demonstration centers, but also truly reinforces our commitment to
delivering faster, localized support to our customer base."
Commenting on today's news, Mark Privett, product manager of bonding
materials at Brewer Science, Inc., added, "Demand for localized TSV
development support in the Asia-Pacific region warranted this
investment. Adding EVG's 500 series bonder to the laboratory in
Taiwan will help accelerate the adoption of TSV and 3DP technology in the
region. The addition of the bonder to the lab also allows us to
provide process training for the region's engineers."
EVG's 500 series wafer bonding system was integrated in the applications
lab in December 2008.
To formally initiate the joint efforts in Taiwan, the companies will host a
technology workshop featuring presentations by EVG and Brewer Science
specialists on solutions for 3D interconnects using thin-wafer handling
technology. This workshop, which will take place in Hsinchu, is
scheduled for January 15, 2009. For more details, please contact EVG
Jointech Corp. via email at sales@EVG-Jointech.com.tw or by phone at +886 3
About Brewer Science
Brewer Science is a leading-edge materials supplier to the electronics
industry and provides solutions for lithography, advanced packaging, MEMS,
nanotechnology, optoelectronics and compound semiconductor applications.
Our extensive product portfolio includes ARC® anti-reflective coatings for
microlithography, ProTEK® temporary etch protective coatings, WaferBOND™
temporary bonding materials, Cee® precision coat-bake-develop equipment and
microelectronics-grade carbon nanotube solutions.
Exceptional technical expertise and extensive semiconductor industry
knowledge, combined with a long tradition of addressing market and customer
needs through its world-class product and customer support, make Brewer
Science an exceptional global supplier of choice.
For further information please visit www.brewerscience.com or email
About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for
semiconductor, MEMS and nanotechnology applications. Through close
collaboration with its global customers, the company implements its
flexible manufacturing model to develop reliable, high-quality,
low-cost-of-ownership systems that are easily integrated into customers'
fab lines. Key products include wafer bonding,
lithography/nanoimprint lithography (NIL) and metrology equipment, as well
as photoresist coaters, cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG
holds a leading position in NIL and lithography for advanced packaging and
MEMS. Along these lines, the company co-founded the EMC-3D consortium
in 2006 to create and help drive implementation of a cost-effective
through-silicon via (TSV) process for major ICs and MEMS/sensors.
Other target semiconductor-related markets include silicon-on-insulator
(SOI), compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates
via a global customer support network, with subsidiaries in Tempe, AZ;
Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li,
Taiwan. The company's unique Triple i approach (invent - innovate -
implement) is supported by a vertical integration, allowing EVG to respond
quickly to new technology developments, apply the technology to
manufacturing challenges and expedite device manufacturing in high
volume. More information is available at www.EVGroup.com.
Brewer Science Contact:
Product Manager, Bonding Materials
EV Group Contacts: Clemens Schütte
Director, Marketing and Communications
EV Group Tel: +43 7712 5311 0
Tel: +1-650-968-8900, ext. 119