ST. PAUL, Minn. / ST. FLORIAN, Austria, December 22, 2008
- 3M and EV Group (EVG) have agreed to settle the patent infringement
litigation brought by EVG against 3M in the U.S. District Court for the
Southern District of New York relating to systems for temporary wafer
bonding.
Under the terms of the settlement, the details of which are confidential,
3M, its customers, and 3M's licensed suppliers of 3M's Wafer Support System
will continue to make, sell and use the Wafer Support System in global
semiconductor and packaging markets. EVG will continue to defend its patent
portfolio and protect its intellectual property.
About EV Group
EV Group (EVG) is a world leader in
wafer-processing solutions for semiconductor, MEMS and nanotechnology
applications. Key products include wafer bonding,
lithography/nanoimprint lithography (NIL) and metrology equipment, as well
as photoresist coaters, cleaners and inspection systems. To protect
the tremendous investment in research and development, which allows EVG to
be at the forefront of setting new standards and bringing emerging
applications to market, the company's products and processes are covered by
numerous patents. For more information, visit www.EVGroup.com.
About 3M
A recognized leader in research and
development, 3M produces thousands of innovative products for dozens of
diverse markets. 3M's core strength is applying its more than 40 distinct
technology platforms - often in combination - to a wide array of customer
needs. With $24 billion in sales, 3M employs 79,000 people worldwide and
has operations in more than 60 countries. For more information, visit
www.3M.com.
EV Group Media Contacts:
Clemens Schütte
Director, Marketing and Communications
Tel: +43 7712 5311 0
E-mail: Marketing@EVGroup.com
Marie Labrie
Vice President
MCA, Inc.
Tel: +1-650-968-8900, ext. 119
E-mail: mlabrie@mcapr.com
3M Media Contact:
Donna Fleming Runyon
3M
Tel. +1 (651) 736-7646