Projects Target More Efficient 3D TSV integration and Covalent Bonding at Room Temperature
GRENOBLE, France – July 10, 2013 – CEA-Leti and EV Group (EVG) have launched a three-year common lab to optimize temporary- and permanent-bonding technologies related to 3D TSV integration and all direct bonding heterostructures.
The lab, which continues more than 10 years of collaboration between the two organizations, is focusing on hardware, software and process development.
“Temporary and permanent bonding equipment and process solutions are key product offerings for EVG,” said Markus Wimplinger, EVG’s corporate technology development and IP director. “This project leverages CEA-Leti’s global leadership in wafer-bonding research and EVG’s unparalleled expertise in developing wafer bonding equipment and process technology.”
“Like all common labs that Leti creates with its partners, this project is designed to produce specific, practical solutions that address current and future market requirements,” said Laurent Malier, CEA-Leti CEO. “This collaboration is targeting results that will make 3D TSV integration more efficient and cost effective and open new areas of wafer bonding using covalent bonding at room temperature.”
“Bringing these approaches to high-volume manufacturing with reliable wafer bonding requires innovative fabrication processes,” said Fabrice Geiger, head of Leti’s Silicon Technology division. “The new equipment and process technology developed within the common lab will allow exciting possibilities, especially for heterogeneous materials stacks, that require very low-temperature wafer bonding.”
Leti is an institute of CEA, a French research-and-technology organization with activities in energy, IT, healthcare, defence and security. Leti is focused on creating value and innovation through technology transfer to its industrial partners. It specializes in nanotechnologies and their applications, from wireless devices and systems, to biology, healthcare and photonics. NEMS and MEMS are at the core of its activities. An anchor of
the MINATEC campus, CEA-Leti operates 8,000-m² of state-of-the-art clean room space on 200mm and 300mm wafer platforms. It employs 1,700 scientists and engineers including 320 Ph.D. students and 200 assignees from partner companies. CEA-Leti owns more than 2,200 patent families.
About EV Group
EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com.
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