Repeat Order for IQ Aligner Further Solidifies EVG's Position as Leading Microlens Molding Solutions Provider for Wafer-level Camera Applications
ST. FLORIAN, AUSTRIA, March 27, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Himax Technologies, Inc., a leading producer of CMOS image sensors, power management devices and semiconductor devices and components used in flat panel displays, has placed a repeat order for an IQ Aligner UV nanoimprint lithography (UV-NIL) system from EVG. The IQ Aligner will be used by Himax to support the company's capacity increase in the production of wafer-level cameras used in mobile phones, notebook computers and other consumer electronic devices, as well as to support the increasingly stringent manufacturing requirements for wafer-level cameras demanded by Himax's customer base. The IQ Aligner will be shipped and installed at Himax's manufacturing facility in Tainan, Taiwan.
"EV Group's flexible IQ Aligner platform and the company's microlens molding process expertise are important enablers in achieving higher levels of quality in wafer-level optics while also lowering their cost of production," stated HC Chen, fab director at Himax. "This adds to our already advanced manufacturing capabilities for CMOS image sensors, and provides us with a key competitive edge by enabling us to offer a complete manufacturing solution to the mobile handset market."
Microlenses are an integral component in the optical systems used in wafer-level cameras, and their quality is a critical factor in determining overall product performance. With cost margins extremely tight for the wafer-level camera market, manufacturers need solutions that enable high repeatability and high accuracy. EVG's IQ Aligner is the industry-proven, high-volume manufacturing solution available today for wafer-level optics-which is essential in supporting the production of smaller, higher-performance wafer-level cameras.
"This repeat order from Himax further extends our market and technology leadership in lens molding, with nearly every major wafer-level optics manufacturer having adopted our suite of solutions," stated Paul Lindner, executive technology director, EV Group. "We look forward to working with Himax to ensure their continued success in developing the advanced wafer-level optics that support their customers' leading-edge product roadmaps."
Himax Technologies, Inc. designs, develops, and markets semiconductors that are critical components of flat panel displays. The Company's principal products are display drivers for large-sized TFT-LCD panels, which are used in desktop monitors, notebook computers and televisions, and display drivers for small- and medium-sized TFT-LCD panels, which are used in mobile handsets and consumer electronics products such as netbook computers, digital cameras, mobile gaming devices, portable DVD players, digital photo frame and car navigation displays. In addition, the Company is expanding its product offerings to include timing controllers, LCD TV and monitor chipset solutions, LCOS projector solutions, power management ICs, CMOS Image Sensors, Infinitely Color Technology and 2D to 3D conversion solutions. Based in Tainan, Taiwan, the Company has regional offices in Hsinchu and Taipei, Taiwan; Ninbo, Foshan, Fuqing, Beijing, Shanghai, Suzhou and Shenzhen, China; Yokohama and Matsusaka, Japan; Cheonan-si, Chungcheongnam-do, South Korea; and Irvine California, USA.
About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers’ fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, Ariz.; Albany, N.Y.; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company’s unique Triple i-approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume. More information is available at www.EVGroup.com.
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