News Archive 2012

EV Group Completes Cleanroom Expansion, Opens New R&D Labs and Customer Training Center at Corporate Headquarters

2012_11EVGCleanroomNew  ST. FLORIAN, Austria, November 27, 2012 - EV Group (EVG) announced the completion of its newly expanded cleanroom IV facility at its corporate headquarters in Austria.  As part of the company's long-term growth strategy to address high-volume tool orders and speed time to market for its worldwide customer base, EV Group doubled its cleanroom space for process development and pilot production services.

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Texas State University Selects EV Group Wafer Bonding System for Advanced Compound Semiconductor and Silicon-Based Power Device Research

2012_11EVG501  ST. FLORIAN, Austria and SAN MARCOS, Texas, U.S., November 13, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has installed an EVG501 wafer bonding system to Texas State University.  The highly flexible R&D system, which is configurable for a variety of wafer bonding processes, has been installed in the university's cleanroom facilities to support advanced compound semiconductor and silicon-based power device research and development.

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EV Group Commands Leadership Position in MEMS Market

  2012_11openhouse  TEMPE, Ariz., November 6, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today highlighted a succession of milestones in the MEMS arena, where the company continues to strengthen its market share.  In 2012, MEMS represented 48 percent of the company's North American sales, up 13 percent from 2011, thanks to strong growth in the mobile device and automotive sensor markets.

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China-based SOI Wafer manufacturer Shenyang Silicon Technology purchases EV Group's EVG850LT 300-mm SOI Production Bonding System

2011_11_EVG850SOI   ST. FLORIAN, Austria, October 9, 2012—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Shenyang Silicon Technology Co. Ltd. (SST) has successfully installed an EVG850LT 300-mm, lowtemperature automated production bonding system for silicon-on-insulator (SOI) materials. The China-U.S. joint-venture SOI wafer provider selected the 300-mm bonder as a follow-on to its prior purchase of a 200-mm EVG850LT. The system has already shipped to SST’s state-of-the-art facility, marking the first installation in China of a 300-mm SOI wafer production tool.

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How EV Group jumped to 4th place

vlsiresearchlogo   SANTA CLARA, CA, October 8, 2012 - 2012 was the first time EV Group (EVG), a wafer bonding and lithography equipment supplier, captured a top five spot in VLSIresearch's 2012 Customer Satisfaction Survey. This was a significant accomplishment because EVG has been growing by leaps and bounds with a combination of excellent products and the fast-growing MEMS and 3D IC semiconductor markets. EVG grew not only in revenues, but they also doubled their production capacity. 

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EV Group's ZoneBOND® Temporary Bonding/Debonding Technology Makes First Foray Into Compound Semiconductor Market

2011_10_ZoneBOND  ST. FLORIAN, Austria, September 24, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order for its EVG850 temporary bonding/debonding (TB/DB) systems from a leading maker of compound semiconductor-based components. 

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EV Group Unveils Its Next-Generation EVG150 Automated Resist Processing Platform for High-Volume Coating/Developing Applications

2012_09EVG150preview    SEMICON TAIWAN, Taipei, September 5, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its next-generation EVG150 automated resist processing system.  The high-volume coater/developer has been completely redesigned to provide customers with a flexible, modular platform that integrates spin coating and developing with EVG's advanced, proprietary spray coating technology.

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EV Group's GEMINI® Wafer Bonding System First to Pass Equipment Maturity Assessment within SEMATECH's 3D Interconnect and Manufacturability Program

2012_07_10Sematech  SEMICON WEST, San Francisco, Calif., July 10, 2012 - EV Group (EVG) today announced that its GEMINI® Automated Wafer Bonding System has become the first product to pass a systematic, rigorous Equipment Maturity Assessment (EMA) implemented within SEMATECH's 3D Interconnect program and ISMI's EMA team.

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EV Group and Brisbane Materials Technology Introduce Breakthrough Anti-Reflective Coating Solution to Boost Power Output of Photovoltaics

2012_07_09brismat    INTERSOLAR NORTH AMERICA, San Francisco, Calif., July 9, 2012 - EV Group (EVG), a leading supplier of coating equipment for the photovoltaics (PV), nanotechnology and semiconductor markets, and Brisbane Materials Technology (BMT), a specialty materials company, today announced they are collaborating to provide a total solution for anti-reflective (AR) coatings for the PV market.

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EV Group Unveils Next-Generation Temporary Bonding and Debonding Platform for High-Volume 3D IC Manufacturing

   thumbnail_overview_EVG850TBDB-(XT-Frame)-bg  ST. FLORIAN, Austria, July 3, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®850TB/DB automated temporary bonding and debonding system built on the company's new XT Frame platform, which has been optimized to support thin-wafer processing for high-volume 3D IC and TSV (through silicon via) manufacturing. 

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A*Star Institute of Microelectronics Announces MEMS Consortium Phase II to Pave the Way for High Volume Manufacturing

  2012_06_ime  A*STAR Institute of Microelectronics (IME) has announced the launch of its Micro-Electro-Mechanical-Systems (MEMS) Consortium Phase II, to accelerate MEMS technology into markets driven by strong demand for next generation mobile devices.

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EV Group Receives First-ever Ranking Among Top Five VLSIresearch 10 BEST Suppliers of Chip Making Equipment

2012_05_vlsi  ST. FLORIAN, AUSTRIA, May 24, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that for the first time, its customers have ranked EVG as one of VLSIresearch's top five 10 BEST Focused Suppliers of Chip Making Equipment companies in the market research firm's extensive customer satisfaction survey results for 2012. 

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Himax Technologies Selects EV Group to Expand Production Capacity for Wafer-Level Optics

thumbnail_overview_IQ_Aligner  ST. FLORIAN, AUSTRIA, March 27, 2012 - EV Group (EVG) today announced that Himax Technologies, Inc., a leading producer of CMOS image sensors, power management devices and semiconductor devices and components used in flat panel displays, has placed a repeat order for an IQ Aligner UV nanoimprint lithography (UV-NIL) system from EVG. 

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Shin-Etsu MicroSi Joins EV Group's Open Platform for Temporary Bonding Materials for 3D IC Manufacturing

   2012_03_ZoneBondOpenPlatform  ST. FLORIAN, Austria and TOKYO, Japan, March 14, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Shin-Etsu Chemical Co., Ltd., the world's largest supplier of semiconductor materials, has joined EVG's open platform for temporary bonding/debonding (TB/DB) materials.

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Tokyo Institute of Technology Installs EV Group Wafer Cleaning System for Advanced Optical IC Research and Development

  2012_03_EVG301_200mm  TOKYO, Japan, March 1, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has shipped an EVG301 semi-automated single-wafer cleaning system to Tokyo Institute of Technology (Tokyo Tech).  The EVG301 has already been installed at Tokyo Tech's Arai-Nishiyama Lab, and is being used in the research and development of advanced optical communication ICs. 

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EV Group Launches Second-Generation EVG620HBL Mask Alignment System for LED Manufacturing

overview_EVG620HBLGenIIschwarz    STRATEGIES IN LIGHT, Santa Clara, Calif., February 7, 2012 – EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, compound semiconductors, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced the EVG620HBL Gen II—the second generation fully automated mask alignment system for volume manufacturing of high-brightness light-emitting diodes (HB-LEDs).

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EV Group Signs Collaboration Agreement with Eulitha to Establish Low-Cost-of-Ownership Nanopatterning Solutions for HB-LED Manufacturing

EVG_EulithaPHABLEpreview  ST. FLORIAN, Austria, January 10, 2012 - EV Group (EVG) today announced that it has signed a joint-development and licensing agreement with Eulitha AG, a pioneer and leader in the production of high-quality nanostructures using advanced lithography techniques.  EVG will integrate Eulitha's PHABLE™ mask-based ultraviolet (UV) photolithography technology with EVG's automated mask aligner product platform.

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