SEMATECH Reports Stellar Results for 1st 450-mm Wafer Using EV Group's Nanoimprint Technology

ALBANY, N.Y. / ST. FLORIAN, Austria, July 18, 2011 - SEMATECH, the global consortium of chipmakers and catalyst for accelerating the commercialization of technology innovations into manufacturing solutions, presented the consortium’s patterning strategy at the ISMI (International SEMATECH Manufacturing Initiative) 450 mm Industry Briefing during SEMICON West 2011. SEMATECH reported on the successful patterning of the world’s first 450 mm Step and Repeat imprinted wafer, featuring 35 nm features, on an EVG770 Gen II NIL Stepper. Read the article by Debra Vogler, Senior Technical Editor for PennWell, and her interview with EVG’s Markus Wimplinger on the ELECTRO IQ website.

 

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