|CS EUROPE, Frankfurt, Germany, March 29, 2011 – EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today received the CS Industry Award for “EPIWAFER PROCESSING” for its EVG®850TB/DB Temporary Bonding/Debonding Systems. ||
The inaugural Compound Semiconductor Industry Awards were presented at the CS Europe Conference in Frankfurt, Germany, which was attended by 150 industry professionals. The awards were established to recognise success and development along the entire value chain of the compound semiconductor industry from research to completed device, focusing on the people, processes and products that drive the industry forward
Based on the independent votes of more than 1500 companies, individuals and organisations within the compound semiconductor industry, EVG won the CS Industry Award against strong competition. “Compound Semiconductor is proud of the CS Industry Awards and the overwhelming response from the compound semiconductor industry," said Richard Stevenson, Editor. “We feel it is important to highlight the technological achievements within the industry. These categories and products represent key areas of innovation in the chip manufacturing process."
At the CS Europe conference, Dr. Thomas Uhrmann, EVG’s Business Development Manager for Compound Semiconductor & Silicon-Based Power Devices, held a presentation about “Engineered substrates for future compound semiconductor devices”.
EVG850TB/DB Temporary Bonding/Debonding Systems
Thin wafer processing is a key enabling technology for compound semiconductor applications such as high-brightness light emitting diodes (HB-LEDs), power devices, radio-frequency (RF) devices, micro-electro-mechanical systems (MEMS), and most recently for through-wafer-via (TWV or TSV for silicon substrates) applications and 3D chip stacking. Handling and processing of thin wafers is quite delicate and requires thin wafer specific equipment modifications for further processing. Especially the high fragility of III-V compound semiconductors makes them prone to wafer breakage.
A far more cost-effective method is temporary bonding of the device wafer to a carrier wafer prior thinning. This carrier wafer provides mechanical stability to the thinned device wafer. The main advantage of this approach is that the device wafer thickness can be further reduced, enabling further improved device performance. Additionally, temporary bonded wafers can be handled and processes like standard bulk wafers. In this way the whole front-end and back-end foundry as well as packaging infrastructure can be utilized.
After thinning and/or backside processing the device wafer is debonded. The debonding technology is the cornerstone of thin wafer handling. The EVG 850TB/DB Temporary Bonding / Debonding system, an integral part of EVG industry proven range of HVM ready production wafer bonding systems, integrates the bonding and debonding steps of thin wafers, as well as cleaning and film frame mounting, in one system. Alternatively the thin wafers can be loaded into coin stacks or put onto thin wafer carriers. Adding only two process steps, temporary bonding and debonding, allows thin wafer processing on standard equipment in any existing fab.
For more information please visit www.csawards.net/results/#ev_group