News Archive 2009
GLENROTHES, SCOTLAND, UK, November 5, 2009 - Semefab (Scotland) Ltd, a leading, independent wafer fab foundry, today announced that it will further broaden its diverse process portfolio with the installation of a wafer bonding system from EV Group.
more... SEMICON Europa 2009, October 6, 2009 – EV Group (EVG) today announced that it has completed the installation of two automated fusion bonding systems for 300-mm wafers at a leading semiconductor foundry and at a major consumer electronics manufacturer.
more... September 29, 2009 - EV Group (EVG) today announced that the RFID/USN Center (Incheon, Korea) has selected EVG's fully automated GEMINI® wafer bonding system for stacked 3D MEMS device development
more... September 17, 2009 - EV Group (EVG) today announced that it will host an EVG Technology Day on October 2, 2009 at the Bilkent Hotel in Ankara, Turkey.
more... ST. FLORIAN, AUSTRIA, July 16, 2009 - EV Group (EVG) today announced a joint effort with Applied Materials, Inc. to develop wafer bonding processes for the manufacture of through-silicon vias (TSVs)
more... SEMICON WEST, San Francisco, Calif. July 14, 2009 - EV Group (EVG), today announced it is witnessing continued momentum during its fiscal year 2009 as the company moves through its third quarter, ending June 30.
more... ST. FLORIAN, AUSTRIA, July 13, 2009 - EV Group (EVG), today unveiled its next-generation UV-nanoimprint lithography (UV-NIL) step and repeat system-the EVG770 Gen II NIL Stepper.
more... ALBANY, NEW YORK and ST. FLORIAN, AUSTRIA, July 9, 2009 - EV Group (EVG), today announced that SEMATECH, the global consortium of chipmakers, has selected EVG's fully automated 300-mm GEMINI® wafer bonder for enabling next-generation TSV and 3D interconnects.
more... Singapore, 30 June 2009 - The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR), today announced the launch of the 10th Electronic Packaging Research Consortium (EPRC-10) to address key integration challenges of 3-dimensional (3-D) Packaging and Embedded Module technologies during a signing ceremony.
more... June 9, 2009 - EV Group (EVG) today announced that it has launched an all-new EVG501 wafer bonder system to address rising cost burdens for its university and R&D customers.
more... MOUNTAIN VIEW, Calif., June 8, 2009—MCA, a global, high-tech public relations agency, today announced it will be hosting an online panel discussion in cooperation with SemiNeedle, dubbed the BrightSpots 3D IC Forum, which will enable industry professionals to partake in an active discussion exploring the key issues surrounding 3D ICs from design to manufacture.
more... June 4, 2009 - EV Group (EVG) today announced that EPCOS – a leading electronic components, modules and systems manufacturer – selected EVG’s fully automated GEMINI wafer bonder for high-volume RF components production at EPCOS’s production facility based in Munich, Germany.
more... May 20, 2009 – EV Group (EVG), is pleased to announce that the company has received the distinction of being named one of the world’s top 10 small suppliers of wafer processing equipment for the seventh consecutive year by VLSI Research, Inc.
more... May 12, 2009 - EV Group (EVG) today announced that Fraunhofer Institute for Applied Optics and Precision Engineering IOF oriented research-selected EVG's UV-based nanoimprint lithography (UV-NIL) step and repeat system for its leading-edge optoelectronic research efforts.
more... April 29, 2009 - EV Group (EVG) today announced it has received an order from
AmberWave Systems for its EVG520IS wafer bonding system and its EVG810LT
low-temperature plasma activation system.
more... April 22, 2009 - EV Group (EVG) today announced that the company will increase
its production capacity in light of strong order intake in its first half year
of fiscal 2009.
more... April 1, 2009 - EV Group (EVG) today announced it has entered a joint
development program (JDP) with CEA/Leti-one of Europe's renowned research labs
focusing on microelectronics and nanotechnology.
more... March 17, 2009 - EV Group (EVG) today announced that they have received an
order for its EVG101D, a photoresist developer, from the University of Tokyo.
more... February 24, 2009 - The international EMC-3D semiconductor equipment and
materials consortium today announced that Applied Materials, Inc. (Nasdaq:
AMAT) has joined the organization.
more... February 3, 2009 - EV Group (EVG) today announced that Sweden-based Silex
Microsystems, the world's largest independent MEMS foundry, has placed a major
follow-on order for its GEMINI automated bond cluster, EVG 6200NT mask and bond
aligner and EVG301 mask cleaner.
more... January 20, 2009 - EV Group (EVG) today announced that leading Korean
components manufacturer, Samsung Electro-Mechanics Co., LTD. (SEMCO), selected
the company’s EVG810LT, a LowTemp® plasma activation system, for its R&D
work involving stacked and 3D MEMS devices.
more... January 7, 2009 - EV Group (EVG) and Brewer Science, Inc., today announced the
installation of an EVG 500 series wafer-bonding system at Brewer Science's
Taiwan applications lab.
more...