ST. FLORIAN, AUSTRIA, December 1, 2006 - EV Group, a
leading supplier of wafer-bonding and lithography equipment for the
advanced packaging, MEMS and semiconductor markets and Sonix Inc. leader in
Advanced Acoustic NDT Solutions for Bonded Wafers & MEMS join forces as
Sonix selects EVG as their Exclusive Worldwide Reseller/Distributor of
selected Sonix products.
In addition to the EVG product portfolio, EVG will now offer Sonix Wafer
Acoustic Microscopes. As a result of this agreement, Sonix and EVG are
committed as strategic partners in providing the most innovative and
technologically advanced solutions for bonding wafers and non-destructive
acoustic inspection systems for all wafer level integration and packaging
from R&D to production.
"In order to offer our customers more options and support their needs with
the most innovative technology for non-destructive testing solutions we
signed a Reseller Distribution Agreement with Sonix Inc." says Erich
Thallner CEO and founder of EV Group.
About Sonix
Sonix Inc., located in Springfield,Virgina, a wholly owned subsidiary of
the Danaher Corporations (NYSE:DHR), is a leading manufacturer of scanning
acoustic microscopes and non-destructive testing equipment. Since opening
it´s doors in 1986, they have been a consistent innovator in
non-destructive testing. Sonix was the first company to deliver PC-based,
digital imaging solutions to their customers. Since then, they have
continued to push the technology envelope and provide their customers with
superior inspection technologies and engineering advancements. For further
information please visit www.Sonix.com
About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for
semiconductor, MEMS and nanotechnology applications. Through close
collaboration with its global customers, the company implements its
flexible manufacturing model to develop reliable, high-quality,
low-cost-of-ownership systems that are easily integrated into customers’
fab lines. Key products include wafer bonding,
lithography/nanoimprint lithography (NIL) and metrology equipment, as well
as photoresist coaters, cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG
holds a leading position in NIL and lithography for advanced packaging and
MEMS. Along these lines, the company co-founded the EMC-3D consortium
in 2006 to create and help drive implementation of a cost-effective
through-silicon via (TSV) process for major ICs and MEMS/sensors.
Other target semiconductor-related markets include silicon-on-insulator
(SOI), compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates
via a global customer support network, with subsidiaries in Tempe, AZ;
Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li,
Taiwan. The company's unique Triple i-approach (invent - innovate -
implement) is supported by a vertical integration, allowing EVG to respond
quickly to new technology developments, apply the technology to
manufacturing challenges and expedite device manufacturing in high volume.
Contacts:
EV Group
Tel: +43 7712 5311 0
E-mail: Marketing@EVGroup.com
Marie Labrie
Vice President
MCA, Inc.
Tel: +1-650-968-8900, ext. 119
E-mail: mlabrie@mcapr.com