ST. FLORIAN, AUSTRIA, May 24, 2007 - EV Group, a leading
supplier of wafer bonding and lithography equipment for the MEMS,
nanotechnology and semiconductor markets has successfully installed an
EVG620 mask aligner at DANCHIP which was established at the beginning of
year 2004 and has focused on research, education, proto-typing, and
small-scale production within micro- and nanotechnology.
"Reducing both the time and cost incurred in transforming new ideas into
viable research areas and products always requires highly skilled and
motivated personnel as well as state-of-the-art cleanroom facility with
advanced and specialized equipment. Addressing tool flexibility and
reliability EV Group could again provide the best technical solution to
perfectly meets our current and future demands", said Mr. Ejner Mose
Hansen, Technical Director of Danchip. "furthermore we do see EVG as a
strong and healthy equipment supplier with a good reputation in the MEMS
market and we are fully satisfied with the technical support coming along
with our previous installed bond and bond alignment equipments", Mr. Hansen
The EVG620 mask aligner is EVG´s most popular precision mask and bond
aligner system. Tool flexibility and it`s modular design have always been
main characteristics of the EVG600 series platform. Ranging from R&D
over small to high volume production, the versatile system concept has
continuously supported customers by performing standard lithography using
top or bottom side microscopes as well as very special applications like
infrared alignment, nano imprint lithography (NIL) or silicon direct
"Even with repeat orders like this one, EVG always has to prove and
demonstrate that the offered system can accomplish customer´s tasks.
Competition is all around and customers nowadays don´t hesitate to change
suppliers if sales support, tool performance or technical support does not
meet their expectations. Especially in this case with the 100% wafer edge
handling option, EVG could additionally convince Danchip to go with the
EVG620 because of local customer references running quite similar equipment
configuration. Finally the deal included the installation of an interim
system to bridge the lead time which should demonstrate that we are not
only selling equipment but providing customer solutions´, Mr. Alois Malzer,
EV Group mask aligner product manager concluded.
DANCHIP is the natural gateway to advanced developments within micro- and
nanotechnology. We are a center at the Technical University of Denmark
(DTU), and we are central to the development of micro- and nanotechnology
in Denmark and abroad, as we both operate and maintain modern cleanroom
facilities enabling optimum processing and develop broad technology bases.
The name DANCHIP is an abbreviation of Danich Advanced Nanotech Center for
Highly Intergrated Production. DANCHIP consists of 1000 m² total cleanroom
laboratory area. The users of the cleanroom at DANCHIP are DTU researchers,
students and private industries working with and developing new products in
the field of nanotechnology.
About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for
semiconductor, MEMS and nanotechnology applications. Through close
collaboration with its global customers, the company implements its
flexible manufacturing model to develop reliable, high-quality,
low-cost-of-ownership systems that are easily integrated into customers’
fab lines. Key products include wafer bonding,
lithography/nanoimprint lithography (NIL) and metrology equipment, as well
as photoresist coaters, cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG
holds a leading position in NIL and lithography for advanced packaging and
MEMS. Along these lines, the company co-founded the EMC-3D consortium
in 2006 to create and help drive implementation of a cost-effective
through-silicon via (TSV) process for major ICs and MEMS/sensors.
Other target semiconductor-related markets include silicon-on-insulator
(SOI), compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates
via a global customer support network, with subsidiaries in Tempe, AZ;
Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li,
Taiwan. The company's unique Triple i-approach (invent - innovate -
implement) is supported by a vertical integration, allowing EVG to respond
quickly to new technology developments, apply the technology to
manufacturing challenges and expedite device manufacturing in high volume.
Tel: +43 7712 5311 0
Tel: +1-650-968-8900, ext. 119