Danchip Selects EVG620 Mask Aligner from EV Group

ST. FLORIAN, AUSTRIA, May 24, 2007 - EV Group, a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets has successfully installed an EVG620 mask aligner at DANCHIP which was established at the beginning of year 2004 and has focused on research, education, proto-typing, and small-scale production within micro- and nanotechnology.

"Reducing both the time and cost incurred in transforming new ideas into viable research areas and products always requires highly skilled and motivated personnel as well as state-of-the-art cleanroom facility with advanced and specialized equipment. Addressing tool flexibility and reliability EV Group could again provide the best technical solution to perfectly meets our current and future demands", said Mr. Ejner Mose Hansen, Technical Director of Danchip. "furthermore we do see EVG as a strong and healthy equipment supplier with a good reputation in the MEMS market and we are fully satisfied with the technical support coming along with our previous installed bond and bond alignment equipments", Mr. Hansen continued.

The EVG620 mask aligner is EVG´s most popular precision mask and bond aligner system. Tool flexibility and it`s modular design have always been main characteristics of the EVG600 series platform. Ranging from R&D over small to high volume production, the versatile system concept has continuously supported customers by performing standard lithography using top or bottom side microscopes as well as very special applications like infrared alignment, nano imprint lithography (NIL) or silicon direct bonding.

"Even with repeat orders like this one, EVG always has to prove and demonstrate that the offered system can accomplish customer´s tasks. Competition is all around and customers nowadays don´t hesitate to change suppliers if sales support, tool performance or technical support does not meet their expectations. Especially in this case with the 100% wafer edge handling option, EVG could additionally convince Danchip to go with the EVG620 because of local customer references running quite similar equipment configuration. Finally the deal included the installation of an interim system to bridge the lead time which should demonstrate that we are not only selling equipment but providing customer solutions´, Mr. Alois Malzer, EV Group mask aligner product manager concluded.

About Danchip
DANCHIP is the natural gateway to advanced developments within micro- and nanotechnology. We are a center at the Technical University of Denmark (DTU), and we are central to the development of micro- and nanotechnology in Denmark and abroad, as we both operate and maintain modern cleanroom facilities enabling optimum processing and develop broad technology bases. The name DANCHIP is an abbreviation of Danich Advanced Nanotech Center for Highly Intergrated Production. DANCHIP consists of 1000 m² total cleanroom laboratory area. The users of the cleanroom at DANCHIP are DTU researchers, students and private industries working with and developing new products in the field of nanotechnology.

About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications.  Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers’ fab lines.  Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS.  Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors.  Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, AZ; Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan.  The company's unique Triple i-approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume.

Contacts:
EV Group
Tel: +43 7712 5311 0
E-mail: Marketing@EVGroup.com

Marie Labrie
Vice President
MCA, Inc.
Tel: +1-650-968-8900, ext. 119
E-mail: mlabrie@mcapr.com

 

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