Customers Rank EVG in 10 BEST for 5 Years Consecutively in the VLSI Research Wafer Processing Equipment Customer Satisfaction Survey

ST. FLORIAN, AUSTRIA, June 26, 2007 - EV Group, based in St. Florian/Inn, Austria, is pleased to announce this year´s result of the VLSI Research Customer Satisfaction Survey. Since 2003 EV Group has been honored among the 10 BEST in the category of Small Suppliers of Wafer Processing Equipment. Customers rated EVG consecutively and especially well for quality of results, and for the company´s commitment to supporting its customers´ needs. EVG is a leading contributor in various technologies, including mask alignment, wafer bonding, wafer coating and cleaning; EVG is dedicated to providing the very best in customer support.

This positive trend shows the quality of our equipment and emphasis on customer satisfaction in comparision to our competitors. These are the fruits of over 27 years of successful research and development and a trust-based partnership with our longtime customers. The company´s vision of "being the first in exploring new techniques and serving next generation applications of micro and nano fabrication technologies" enables its customers to successfully commercialize their new ideas. This ensures EVG longterm financial stability and creates the foundation of continuous development and success.

About the survey
The VLSI Research annual Customer Satisfaction Survey on Chip Making Equipment is the only publicly available opportunity for chip manufacturers to provide feedback to their suppliers. The 10 BEST rankings award special recognition to the suppliers that are rated highest by end-users on a ten-point scale among thirteen categories that exemplify a supplier´s relationship with its customers.

About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers’ fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, AZ; Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company's unique Triple i-approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume.

Contacts:
EV Group
Tel: +43 7712 5311 0
E-mail: Marketing@EVGroup.com

Marie Labrie
Vice President
MCA, Inc.
Tel: +1-650-968-8900, ext. 119
E-mail: mlabrie@mcapr.com

 

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