ST. FLORIAN, AUSTRIA, July 16, 2007 - EV Group, based in
St. Florian/Inn, Austria, and Brewer Science, Inc., based in Rolla,
Missouri, USA, announce that they have introduced a new system and offer
new capabilities and yield performance for UltraThin Wafer Processing.
Semiconductor manufacturers continue to push for increasingly thinner
wafers and devices. This push is driven by the need for innovative
packaging options such as 3-D packaging and by demands for higher device
performance and lower power consumption. Until today, no clearly superior
manufacturing process had emerged for handling UltraThin wafers. Brewer
Science and EVG have collaborated to create a new temporary wafer bonding
technology to provide a novel solution for processing UltraThin wafers.
This technology solution is comprised of Brewer Science's WaferBONDTM HT
series of materials and EV Group's bonding and debonding equipment
platforms (EVG850TBDB) and the development of a solution for safely and
reliably processing sub-100 micron thinned wafers.
This jointly developed technology performs temporary bonding of original
thickness device wafers onto rigid carrier wafers. The application of the
WaferBONDTM HT materials via a spin-coating, baking and subsequent bonding
process is performed on EVG850TB system. Highest yield and manufacturing
performance through thinning and further backside processing steps are
maintained with the created waferstack. In addition, the WaferBONDTM HT
material enables utilization of, until today, unknown high-temperature
processing steps and high-vacuum compatibility.
The EVG850TB/DB platform is EVG's well proven and accepted equipment
platform, enabling highest yield, performance and uptime in a high-volume
manufacturing environment while enabling safe and reliable handling and
processing of thin and UtraThin wafers.
The commercialized system is the result of a multiyear partnership between
Brewer Science and EV Group. These solutions will be introduced at SEMICON®
West 2007, and the companies have extended their collaboration for
increasing the process latitude of future material sets.
About Brewer Science
Brewer Science, a multidivisional technology company, has pioneered
industry-enabling innovations from ARC® anti-reflective coatings to ProTEK®
etch protective coatings. Following on its long tradition of being first to
introduce and implement cutting-edge technologies, Brewer Science is proud
to introduce WaferBOND? HT temporary wafer bond series of materials. Brewer
Science is a major producer of high-quality materials, processes and
machine solutions that meet the stringent requirements of today's IC,
compound semiconductor, MEMS, and optoelectronic industries. Under the
leadership of Dr. Terry Brewer, president and founder, Brewer Science
continues to develop innovative technologies, reliable products, and
responsive services, each attuned to the specific needs of individual
customers. Further information on the technology and product information
from Brewer Science can be obtained via the company's website at
About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for
semiconductor, MEMS and nanotechnology applications. Through close
collaboration with its global customers, the company implements its
flexible manufacturing model to develop reliable, high-quality,
low-cost-of-ownership systems that are easily integrated into customers’
fab lines. Key products include wafer bonding, lithography/nanoimprint
lithography (NIL) and metrology equipment, as well as photoresist coaters,
cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG
holds a leading position in NIL and lithography for advanced packaging and
MEMS. Along these lines, the company co-founded the EMC-3D consortium in
2006 to create and help drive implementation of a cost-effective
through-silicon via (TSV) process for major ICs and MEMS/sensors. Other
target semiconductor-related markets include silicon-on-insulator (SOI),
compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates
via a global customer support network, with subsidiaries in Tempe, AZ;
Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan.
The company's unique Triple i-approach (invent - innovate - implement) is
supported by a vertical integration, allowing EVG to respond quickly to new
technology developments, apply the technology to manufacturing challenges
and expedite device manufacturing in high volume.
Tel: +43 7712 5311 0
Tel: +1-650-968-8900, ext. 119