Ultra-thin Wafer Handling Solution Introduced by Brewer Science and EV Group

ST. FLORIAN, AUSTRIA, July 16, 2007 - EV Group, based in St. Florian/Inn, Austria, and Brewer Science, Inc., based in Rolla, Missouri, USA, announce that they have introduced a new system and offer new capabilities and yield performance for UltraThin Wafer Processing.

Semiconductor manufacturers continue to push for increasingly thinner wafers and devices. This push is driven by the need for innovative packaging options such as 3-D packaging and by demands for higher device performance and lower power consumption. Until today, no clearly superior manufacturing process had emerged for handling UltraThin wafers. Brewer Science and EVG have collaborated to create a new temporary wafer bonding technology to provide a novel solution for processing UltraThin wafers. This technology solution is comprised of Brewer Science's WaferBONDTM HT series of materials and EV Group's bonding and debonding equipment platforms (EVG850TBDB) and the development of a solution for safely and reliably processing sub-100 micron thinned wafers.

This jointly developed technology performs temporary bonding of original thickness device wafers onto rigid carrier wafers. The application of the WaferBONDTM HT materials via a spin-coating, baking and subsequent bonding process is performed on EVG850TB system. Highest yield and manufacturing performance through thinning and further backside processing steps are maintained with the created waferstack. In addition, the WaferBONDTM HT material enables utilization of, until today, unknown high-temperature processing steps and high-vacuum compatibility.

The EVG850TB/DB platform is EVG's well proven and accepted equipment platform, enabling highest yield, performance and uptime in a high-volume manufacturing environment while enabling safe and reliable handling and processing of thin and UtraThin wafers.
The commercialized system is the result of a multiyear partnership between Brewer Science and EV Group. These solutions will be introduced at SEMICON® West 2007, and the companies have extended their collaboration for increasing the process latitude of future material sets.

About Brewer Science
Brewer Science, a multidivisional technology company, has pioneered industry-enabling innovations from ARC® anti-reflective coatings to ProTEK® etch protective coatings. Following on its long tradition of being first to introduce and implement cutting-edge technologies, Brewer Science is proud to introduce WaferBOND? HT temporary wafer bond series of materials. Brewer Science is a major producer of high-quality materials, processes and machine solutions that meet the stringent requirements of today's IC, compound semiconductor, MEMS, and optoelectronic industries. Under the leadership of Dr. Terry Brewer, president and founder, Brewer Science continues to develop innovative technologies, reliable products, and responsive services, each attuned to the specific needs of individual customers. Further information on the technology and product information from Brewer Science can be obtained via the company's website at www.brewerscience.com.

About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers’ fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, AZ; Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company's unique Triple i-approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume.

Contacts:
EV Group
Tel: +43 7712 5311 0
E-mail: Marketing@EVGroup.com

Marie Labrie
Vice President
MCA, Inc.
Tel: +1-650-968-8900, ext. 119
E-mail: mlabrie@mcapr.com

 

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