ST. FLORIAN, AUSTRIA, Oct. 9, 2007 - EV Group, a leading
supplier of wafer bonding and thin-wafer processing equipment for advanced
semiconductors, MEMS and nanotechnology, today announced that a major
Austrian semiconductor manufacturer has selected and installed an EVG850TB
fully automated temporary bonding system for high-volume processing of
thin- and ultra-thin device wafers. The EVG bonder allows secure and
reliable handling of high-value wafers while contributing to higher yield -
a key factor for future power device applications, consumer appliances and
other semiconductor-based markets.
The growing need to reduce device power consumption is driving the need for
thin- and ultra-thin wafers, requiring special processing techniques
including, temporary bonding of wafers to a carrier substrate and
de-bonding of wafers following back-grinding and other processing steps.
The EVG bonding tool offers increased process flexibility as it allows for
automated handling, cleaning, lamination and bonding of a back-thinned
device wafer to carrier wafers with different intermediate materials used
for temporary bonding.
Leveraging the EVG850TB´s UTLRATHIN® Wafer Processing Technology enables
the customer to expand its thin- and ultra-thin wafer processing
capabilities, further increasing device yield for complex, fragile
semiconductors, while adding process safety and reliability essential for
According to a spokesperson, "Automatic processing of ultra-thin substrates
in the thickness range of below 100 micron on various wafer sizes isn´t an
easy task. Increased diameter variations, as well as handling sensitivity
and reduced wafer-edge quality from back grinding, substrate warping,
fragile and brittle materials, all require a specialized know-how and a lot
of experience to deal with an automated system platform. EVG has accepted
the challenge and successfully achieved it."
Stefan Pargfrieder, business development manager of EV Group, noted, "This
is the world´s first system that can perfectly align and center carrier
wafers, device wafers and dry laminated adhesive tape on an automated
cluster platform, dealing with various substrate diameters. It also
integrates pre-processing and post-processing steps, such as coating,
protective-film removal and cleaning. This major customer again selected
EVG to jointly develop and install this fully automated temporary
thin-wafer processing equipment due to our proven technology portfolio and
expertise in thin-wafer processing."
Further information regarding EVG´s EVG850TB bonding system, as well as its
full portfolio of leading-edge thin-wafer handling and lithography
equipment, will be available during SEMICON Europa, Oct. 9-11, 2007 at the
Stuttgart Trade Fair Centre in Stuttgart, Germany. Editors and analysts
interested in learning more about the company and its products are invited
to visit EVG´s booth #912 (Hall 1).
About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for
semiconductor, MEMS and nanotechnology applications. Through close
collaboration with its global customers, the company implements its
flexible manufacturing model to develop reliable, high-quality,
low-cost-of-ownership systems that are easily integrated into customers’
fab lines. Key products include wafer bonding, lithography/nanoimprint
lithography (NIL) and metrology equipment, as well as photoresist coaters,
cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG
holds a leading position in NIL and lithography for advanced packaging and
MEMS. Along these lines, the company co-founded the EMC-3D consortium in
2006 to create and help drive implementation of a cost-effective
through-silicon via (TSV) process for major ICs and MEMS/sensors. Other
target semiconductor-related markets include silicon-on-insulator (SOI),
compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates
via a global customer support network, with subsidiaries in Tempe, AZ;
Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan.
The company's unique Triple i-approach (invent - innovate - implement) is
supported by a vertical integration, allowing EVG to respond quickly to new
technology developments, apply the technology to manufacturing challenges
and expedite device manufacturing in high volume.
Tel: +43 7712 5311 0
Tel: +1-650-968-8900, ext. 119