EV Group´s new EVG850TB Bonding System Selected by Major Austrian Semiconductor Maker for High-Volume, Ultra-thin Wafer Processing

ST. FLORIAN, AUSTRIA, Oct. 9, 2007 - EV Group, a leading supplier of wafer bonding and thin-wafer processing equipment for advanced semiconductors, MEMS and nanotechnology, today announced that a major Austrian semiconductor manufacturer has selected and installed an EVG850TB fully automated temporary bonding system for high-volume processing of thin- and ultra-thin device wafers. The EVG bonder allows secure and reliable handling of high-value wafers while contributing to higher yield - a key factor for future power device applications, consumer appliances and other semiconductor-based markets.

The growing need to reduce device power consumption is driving the need for thin- and ultra-thin wafers, requiring special processing techniques including, temporary bonding of wafers to a carrier substrate and de-bonding of wafers following back-grinding and other processing steps. The EVG bonding tool offers increased process flexibility as it allows for automated handling, cleaning, lamination and bonding of a back-thinned device wafer to carrier wafers with different intermediate materials used for temporary bonding.

Leveraging the EVG850TB´s UTLRATHIN® Wafer Processing Technology enables the customer to expand its thin- and ultra-thin wafer processing capabilities, further increasing device yield for complex, fragile semiconductors, while adding process safety and reliability essential for high-volume production.
According to a spokesperson, "Automatic processing of ultra-thin substrates in the thickness range of below 100 micron on various wafer sizes isn´t an easy task. Increased diameter variations, as well as handling sensitivity and reduced wafer-edge quality from back grinding, substrate warping, fragile and brittle materials, all require a specialized know-how and a lot of experience to deal with an automated system platform. EVG has accepted the challenge and successfully achieved it."

Stefan Pargfrieder, business development manager of EV Group, noted, "This is the world´s first system that can perfectly align and center carrier wafers, device wafers and dry laminated adhesive tape on an automated cluster platform, dealing with various substrate diameters. It also integrates pre-processing and post-processing steps, such as coating, protective-film removal and cleaning. This major customer again selected EVG to jointly develop and install this fully automated temporary thin-wafer processing equipment due to our proven technology portfolio and expertise in thin-wafer processing."

Further information regarding EVG´s EVG850TB bonding system, as well as its full portfolio of leading-edge thin-wafer handling and lithography equipment, will be available during SEMICON Europa, Oct. 9-11, 2007 at the Stuttgart Trade Fair Centre in Stuttgart, Germany. Editors and analysts interested in learning more about the company and its products are invited to visit EVG´s booth #912 (Hall 1).

About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers’ fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, AZ; Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company's unique Triple i-approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume.

Contacts:
EV Group
Tel: +43 7712 5311 0
E-mail: Marketing@EVGroup.com

Marie Labrie
Vice President
MCA, Inc.
Tel: +1-650-968-8900, ext. 119
E-mail: mlabrie@mcapr.com

 

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