ST. FLORIAN, AUSTRIA, November 6, 2007 - EV Group, a
leading supplier of wafer-bonding and lithography equipment for the
advanced packaging, 3D interconnect, MEMS, SOI (Silicon-On-Insulator),
nanotechnology, compound semiconductor and silicon-based power devices
markets, today announced that it achieved record financial results for
fiscal 2007, ended Sept. 30.
The company realized a 30-percent overall increase in both revenue and
order intake compared to fiscal 2006 - making 2007 its most successful year
to date in its two decade-plus history, and serving as further evidence of
EVG´s leadership in successfully delivering high-volume manufacturing
solutions to its global customer base.
Follow-on orders in high-volume manufacturing applications - a fast-growing
segment of EVG´s business - were a primary driver behind the 30-percent
boost in orders. Another significant factor was new technologies, with
advanced packaging applications, including thin-wafer handling and 3D
interconnect, leading the surge. This market is of key significance to
EVG´s technology portfolio; in 2006, the company co-founded the EMC-3D
Consortium to create and help drive implementation of a cost-effective
through-silicon via (TSV) process for chip stacking and packaging of
MEMS/sensors.
The company also saw an overall increase in business for its coater,
aligner and bonder solutions.
Commenting on the company´s record performance, EV Group Founder and Chief
Executive Officer Erich Thallner, noted, "With these results, we have not
only bested our own long-term targets, but we are also on track to
outperform the semiconductor and related industry markets. To ensure our
ability to help our customers achieve sustainable growth, we´ve implemented
a number of crucial steps. During fiscal 2007, EVG strengthened its global
headcount by 15 percent, bringing our total number of employees to more
than 400. We also doubled our worldwide cleanroom capacity to enhance our
process development and demonstration capabilities (up to Class 10); and
expanded the manufacturing area at our corporate headquarters by 25
percent.
Additionally, as a total solution supplier, we furthered our goal of
serving as a single source for customers´ wafer-processing needs by
offering complementary products from our strategic partners. Together,
these moves position us to continue satisfying customer requirements going
forward, whether for next-generation process development or advanced
production capabilities."
Indicative of the EVG´s customer-centric focus, this announcement closely
follows the company´s fifth consecutive selection as one of the industry´s
10 BEST small suppliers of wafer-processing equipment in the annual
customer-satisfaction survey conducted by San Jose, Calif.-based VLSI
Research Inc. The company was ranked particularly high for quality of
results and for its commitment to supporting customers´ needs.
About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for
semiconductor, MEMS and nanotechnology applications. Through close
collaboration with its global customers, the company implements its
flexible manufacturing model to develop reliable, high-quality,
low-cost-of-ownership systems that are easily integrated into customers’
fab lines. Key products include wafer bonding, lithography/nanoimprint
lithography (NIL) and metrology equipment, as well as photoresist coaters,
cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG
holds a leading position in NIL and lithography for advanced packaging and
MEMS. Along these lines, the company co-founded the EMC-3D consortium in
2006 to create and help drive implementation of a cost-effective
through-silicon via (TSV) process for major ICs and MEMS/sensors. Other
target semiconductor-related markets include silicon-on-insulator (SOI),
compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates
via a global customer support network, with subsidiaries in Tempe, AZ;
Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan.
The company's unique Triple i-approach (invent - innovate - implement) is
supported by a vertical integration, allowing EVG to respond quickly to new
technology developments, apply the technology to manufacturing challenges
and expedite device manufacturing in high volume.
Contacts:
EV Group
Tel: +43 7712 5311 0
E-mail: Marketing@EVGroup.com
Marie Labrie
Vice President
MCA, Inc.
Tel: +1-650-968-8900, ext. 119
E-mail: mlabrie@mcapr.com