ST. FLORIAN, AUSTRIA, January 16, 2008 - EV Group, a
leading supplier of manufacturing equipment for the advanced packaging/3D
interconnect, MEMS, SOI (silicon-on-insulator), nanotechnology, compound
semiconductor and silicon-based power devices markets, today announced that
it has received a multi-million-Euro order from a leading European plastic
electronics manufacturer for the high-volume production of flexible
displays. The multiple system order will be installed at the customer´s
facility between now and mid-2008, and leveraged in the development of
flexible display modules used within thin, light and robust consumer
electronics products, such as portable electronic readers.
Today´s announcement is a key milestone for EVG as it demonstrates the
successful deployment of EVG´s advanced coating technology in the flexible
display arena. Since 2004, EVG has been working closely with Arizona State
University´s Flexible Display Center (FDC) to leverage its advanced resist
coating technology to address the burgeoning flexible display arena. The
FDC, of which EVG is a principal member, is a
university/industry/government collaborative venture chartered with
developing high performance, commercially-viable, conformal and flexible
displays that are lightweight, rugged, low power and low cost. Today´s
order from a leading plastics electronics maker underscores the tremendous
development achievements realized between EVG and FDC´s strong
collaboration over the past few years.
The production of flexible displays pose myriad challenges, namely
manufacturing equipment´s ability to support flexible substrates, such as
plastic, which lacks the mechanical and thermal stability typically
afforded by the rigid and durable -yet unconformable - glass substrate. As
a result, the fabrication of flexible displays places strict demands on
processing equipment. EVG addresses these challenges with its advanced
processing systems, which provide special handling capabilities for
processing fragile substrates in varying size and thickness. High uptime
and ease of maintenance contribute to increased performance and yield.
Moreover, the tools´ ability to produce highly uniform coats at low
material usage and improved repeatability equate to a low cost of
ownership. EVG reports that all of these advantages and performance
capabilities, coupled with its comprehensive 24/7 service and support
infrastructure, were critical factors behind this order win.
Commenting on today´s announcement, Erich Thallner, CEO and founder of EVG,
noted, "We´re constantly looking at new opportunities and markets that will
let us leverage our proven workhorse technology to enter promising new
markets. The flexible display market continues to make significant strides
and EVG is proud to be at the forefront of helping drive this technology
into mainstream adoption. Today´s order is testament to our ability to help
customers reduce the time and cost it takes to get products to market by
delivering highly integrated systems and customized solutions that allow
them to realize significant growth opportunities. Moreover, it shows the
value of R&D collaboration and how, by working in tandem with customers
and other industry partners, we can move from vision to market fruition -
quickly and more cost effectively."
About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for
semiconductor, MEMS and nanotechnology applications. Through close
collaboration with its global customers, the company implements its
flexible manufacturing model to develop reliable, high-quality,
low-cost-of-ownership systems that are easily integrated into customers’
fab lines. Key products include wafer bonding, lithography/nanoimprint
lithography (NIL) and metrology equipment, as well as photoresist coaters,
cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG
holds a leading position in NIL and lithography for advanced packaging and
MEMS. Along these lines, the company co-founded the EMC-3D consortium in
2006 to create and help drive implementation of a cost-effective
through-silicon via (TSV) process for major ICs and MEMS/sensors. Other
target semiconductor-related markets include silicon-on-insulator (SOI),
compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates
via a global customer support network, with subsidiaries in Tempe, AZ;
Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan.
The company's unique Triple i-approach (invent - innovate - implement) is
supported by a vertical integration, allowing EVG to respond quickly to new
technology developments, apply the technology to manufacturing challenges
and expedite device manufacturing in high volume.
Tel: +43 7712 5311 0
Tel: +1-650-968-8900, ext. 119