ST. FLORIAN, AUSTRIA, February 5, 2008 - EV Group, a
leading supplier of wafer-bonding and lithography equipment for the
advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and
emerging nanotechnology markets, today announced it has received an order
from the Indian Institute of Technology (IIT), Bombay, for two of EVG´ s
MEMS-focused systems. IIT Bombay purchased the EVG620TB bond and mask
aligner and EVG501 wafer bonder for a new Indian government-supported
automotive MEMS R&D project being pursued in close cooperation with the
Indian Institute of Science, Bangalore, which previously purchased the same
EVG equipment. The new EVG systems are slated for installation this month
in IIT Bombay´s Mumbai facility.
According to estimates by Phoenix-based market research and consulting firm
Semiconductor Partners, the MEMS market will reach US$10 billion by 2011.
Automotive MEMS represent the second largest segment within the overall
MEMS market, after IT peripherals, with the number of MEMS devices per
vehicle expected to increase by approximately one-third over the same
"We created the Centre of Excellence in Nanoelectronics at IIT Bombay for
the specific purpose of conducting research in nano-scale devices and
micro-fabricated sensors, and we are pleased to note that it is considered
one of India´s leading laboratories in this field," said Prof. V. Ramgopal
Rao, Chief Investigator for the Nanoelectronics Centre Project, IIT Bombay.
"We selected the EVG equipment for the Nanoelectronics Centre facility
based on the strong recommendation of our partner organization in
Bangalore. This synergy between the two institutes will facilitate our
R&D activities, and help ensure the highest possible quality of
According to Herwig Kirchberger, EVG Business Development Manager, "The
rapid rate of growth of India´s technology infrastructure is driving demand
for ongoing technology exploration and development. Partnering with this
prestigious research institute provides EV Group with an exciting
opportunity to leverage its technological leadership in the MEMS market to
ensure that the region´s efforts in this sector produce useful results that
can ultimately be transferred to production-level automotive applications."
The EVG620TB performs precise wafer/substrate alignment with 1 micron
alignment accuracy for wafer-bonding applications. It features a
high-resolution, bottom-side split-field microscope and special
capabilities to support MEMS processing requirements, including bond
alignment for double and triple stacks, and universal align/bond chucks to
transfer aligned wafers to wafer-bonding systems in the EVG500 family.
The EVG501 performs anodic, thermo-compression, fusion bonding or
low-temperature plasma bonding via a single, universal bond chamber in
which the top and bottom of the wafer are heated independently to
compensate for different coefficients of thermal expansion. The system can
support all MEMS wafer sizes and materials up to 150mm, with full support
for fragile or bowed wafers, and is designed for ease of transfer from
R&D to volume production.
About IIT Bombay
IIT Bombay was established in 1958, at Powai, a northern suburb of Mumbai.
Today, the Institute is recognized as one of the centers of academic
excellence in the country. IIT Bombay also places considerable emphasis on
research and development work. The Institute plays a very significant role
in diverse facets of R&D, keeping pace with the rapidly expanding
frontiers of knowledge, national needs and global developments. Its
pre-eminent position at the cutting edge of research is reflected in its
impressive catalog of research projects, funded by national/international
and government agencies and industries. More information can be found at
About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for
semiconductor, MEMS and nanotechnology applications. Through close
collaboration with its global customers, the company implements its
flexible manufacturing model to develop reliable, high-quality,
low-cost-of-ownership systems that are easily integrated into customers’
fab lines. Key products include wafer bonding, lithography/nanoimprint
lithography (NIL) and metrology equipment, as well as photoresist coaters,
cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG
holds a leading position in NIL and lithography for advanced packaging and
MEMS. Along these lines, the company co-founded the EMC-3D consortium in
2006 to create and help drive implementation of a cost-effective
through-silicon via (TSV) process for major ICs and MEMS/sensors. Other
target semiconductor-related markets include silicon-on-insulator (SOI),
compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates
via a global customer support network, with subsidiaries in Tempe, AZ;
Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan.
The company's unique Triple i-approach (invent - innovate - implement) is
supported by a vertical integration, allowing EVG to respond quickly to new
technology developments, apply the technology to manufacturing challenges
and expedite device manufacturing in high volume.
Tel: +43 7712 5311 0
Tel: +1-650-968-8900, ext. 119