ST. FLORIAN, AUSTRIA, February 21, 2008 - EV Group, a
leading supplier of manufacturing equipment for the advanced packaging/3D
interconnect, MEMS, SOI, nanotechnology, compound semiconductor and
silicon-based power devices markets, today announced that it has received a
multiple system order from Colibrys, a world-leading supplier of standard
and custom MEMS-based motion sensors for harsh-environment and safety
critical applications. This follow-on order is for one EVG520
semi-automated wafer bonding system and two EVG620 fully automated
mask/bond aligners. One bonder and aligner tool set was installed at the
Colibrys Inc. manufacturing facility in Stafford, Texas in January, while
the other will be installed at the company's headquarters in Neuchatel,
Switzerland before the end of the first quarter of 2008. Follow-on orders
like this helped EVG realize a 30-percent overall increase in both revenue
and order intake in 2007.
According to Colibrys' Vice President of Operations, Jim Marsh, "Our
company is dedicated to delivering only the highest performance, highest
reliability MEMS-based motion sensors for harshenvironment (energy,
military and aerospace) and safety critical (industrial and
instrumentation) markets. In turn, we demand the best from our suppliers
when it comes to process capabilities, quality and comprehensive support.
EVG has been a valued supplier to Colibrys over the last decade, providing
the high-quality wafer bonding and aligner technology needed to
cost-effectively manufacture our best-in-class MEMS sensors in high
volume."
Marsh added that aside from the business growth, there were a number of
specific factors leading to this most recent purchasing decision. This
included the tool sets flexibility in handling difficult substrates;
high-force bonding capabilities, which are unparalleled in the industry;
and repeatability and reliable performance. In addition, EVG's local
support presence in both the U.S. and Europe, and the company's ability to
deliver products in a short time frame to address Colibrys' manufacturing
capacity expansion plans, were also critical in winning this order.
"On top of our two-decades-plus years of experience in the market, we offer
best-of-breed equipment and process expertise to today's MEMS value chain,
all at a low cost of ownership", noted EVG's CTO, Paul Linder. "We are
committed to working closely with our customers to ensure their
manufacturing processes are running at benchmark levels. All of this,
coupled with our demonstrated and reliable performance and comprehensive
support, is the reason leaders like Colibrys continue to turn to EVG for
wafer bonding in high-volume MEMS manufacturing. In fact, 27 of today's top
30 MEMS manufacturers leverage EVG's equipment and that number continues to
grow."
For more than 25 years, EVG has been providing cutting-edge equipment and
process solutions to the MEMS industry, introducing the first backside
lithography systems for the MEMS market in 1985. Over the years, the
company has expanded its solution set to include a full portfolio of
advanced manufacturing equipment for the MEMS market, such as full-field
lithography, wafer alignment and bonding, resist coating, and developing
and inspection. Today's news follows on the heels of a major MEMS-related
milestone the company announced late last year - the installation of its
500th bond chamber and 100th automated wafer bonder for high-volume
manufacturing, which underscores the importance of wafer bonding as a key
process for MEMS production.
About Colibrys
Colibrys is a world-leading supplier of standard and semi-custom MEMS based
motion sensors to the harsh-environment (Energy, Military and Aerospace),
and safety critical (Industrial and Instrumentation) applications. Colibrys
has the full breadth of MEMS capability, undertaking design, development,
wafer manufacture, packaging and test of MEMS components. Additional
information is available at www.colibrys.com
About EV Group
EV Group (EVG) is a world leader in
wafer-processing solutions for semiconductor, MEMS and nanotechnology
applications. Through close collaboration with its global customers, the
company implements its flexible manufacturing model to develop reliable,
high-quality, low-cost-of-ownership systems that are easily integrated into
customers’ fab lines. Key products include wafer bonding,
lithography/nanoimprint lithography (NIL) and metrology equipment, as well
as photoresist coaters, cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG
holds a leading position in NIL and lithography for advanced packaging and
MEMS. Along these lines, the company co-founded the EMC-3D consortium in
2006 to create and help drive implementation of a cost-effective
through-silicon via (TSV) process for major ICs and MEMS/sensors. Other
target semiconductor-related markets include silicon-on-insulator (SOI),
compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates
via a global customer support network, with subsidiaries in Tempe, AZ;
Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan.
The company's unique Triple i-approach (invent - innovate - implement) is
supported by a vertical integration, allowing EVG to respond quickly to new
technology developments, apply the technology to manufacturing challenges
and expedite device manufacturing in high volume.
Contacts:
EV Group
Tel: +43 7712 5311 0
E-mail: Marketing@EVGroup.com
Marie Labrie
Vice President
MCA, Inc.
Tel: +1-650-968-8900, ext. 119
E-mail: mlabrie@mcapr.com