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EV Group wins Compound Semiconductor Manufacturing Award at the CSindustry awards 2014

CS-Awards-Winnerjpg  FRANKFURT/ ST. FLORIAN, March 19, 2014 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, received a prestigious Compound Semiconductor Manufacturing Award at CS International 2014 for the company's EVG®PHABLE™ exposure system.

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EV Group Establishes China Headquarters in Shanghai

201403_EVGChina  SEMICON CHINA, Shanghai, March 18, 2014 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has opened a new, wholly owned subsidiary in Shanghai, called EV Group China Ltd., which will serve as regional headquarters for all of EVG's operations in the People's Republic of China.  The new subsidiary, which houses a local service center and spare parts management facility, will further strengthen EVG's presence in the region and support the company's ongoing efforts to improve service and response times to local customers.

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EV Group Boosts 2.5D and 3D-IC/TSV Performance with New NanoSpray™ Application on EVG150XT High-Volume-Manufacturing Photoresist Processing System

EVG2014_03150NXT-Automated-NanoSpray-Coating-System  ST. FLORIAN, Austria, March 12, 2014 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that its patented NanoSpray conformal coating technology is now available on its newly introduced EVG150XT resist coating and developing system for high-volume manufacturing (HVM) semiconductor applications.  NanoSpray provides conformal coating of structures that have vertical sidewall angles-such as through-silicon vias (TSVs), through-glass vias and through-substrate vias used for 2.5D interposers and 3D-ICs-with thick polymer liners and photoresists.  This unique capability, which is already available on previous-generation EVG resist processing platforms, has been used in production to reduce mechanical stress and improve electrical performance of these advanced-packaging interconnect structures.

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EV Group and Brisbane Materials Introduce Novel Anti-Reflective Coating Solution for LED Lighting Applications at Strategies in Light

  201402ARCoatingforLED   STRATEGIES IN LIGHT, Santa Clara, Calif., February 25, 2014 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, solar and semiconductor markets, and Brisbane Materials Technology (BMT), a specialty materials company, today introduced a new anti-reflective (AR) coating solution based on BMT's innovative XeroCoat® materials, which is designed to substantially increase lumen output of light emitting diode (LED) devices.  The jointly developed manufacturing solution, which leverages a combination of AR coating processing equipment and tunable, durable, inorganic coating material, enables lumen output increases of up to eight percent. 

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EV Group Unveils High-Volume-Manufacturing Photoresist Processing System for Logic and Memory Advanced Packaging Applications

  EVG150XT-HVM-Resist-Processing-System   ST. FLORIAN, Austria, February 11, 2014 - EV Group (EVG) today unveiled its most advanced 300-mm photoresist processing system for logic and memory high-volume manufacturing (HVM)-the EVG150XT resist coating and developing system.  Leveraging EVG's XT Frame platform utilized across the spectrum of the company's industry-leading systems, the EVG150XT is optimized for ultra-high throughput and productivity-bringing the company's expertise in lithography processing to HVM environments. 

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EV Group Ships Temporary Bonding/Debonding System to Fraunhofer ISIT for Developing Advanced Power Devices

  201401EVG-Fraunhofer-ISIT-IGBT-Wafer   ST. FLORIAN, Austria, January 14, 2014 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the Fraunhofer Institute for Silicon Technology (ISIT) has purchased an EVG®850TB/DB fully automated bonding/debonding equipment solution.  The system has been shipped and installed at Fraunhofer ISIT's facility in Itzehoe, Germany, where it is being used in the development and production of next-generation power devices, including PowerMOS and Insulated Gate Bipolar Transistors (IGBTs).

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