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- Launch of the EVG620HBL Automated Mask Alignment System for HB-LED, delivering highest-in-class throughput and yield.
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- Introduction of the industry´s first Wafer Bonding System for 450 mm SOI semiconductor wafers: EVG850SOI/450 mm.
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- EVG Headquarters Expansion to more than double the company´s production floor space in light of very strong order intake.
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- Launch of new flagship model with enhanced throughput and automation performance in the GEMINI FB family of Fusion Wafer Bonding Systems.
- Launch of new XT Frame equipment platform to boost High-Volume Manufacturing performance.
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