History

historysite-new-historywall-headings4

2010 

EVG560
  • Implementation and successful certification of an environmental management system according to ISO 14001.
  • Launch of the EVG560®HBL, the industry´s first Fully Automated Wafer Bonding System for High Brightness LED Manufacturing.

 

2011

  EVG620HBL-gesamt2

  • Launch of the EVG620®HBL Automated Mask Alignment System for HB-LED, delivering highest-in-class throughput and yield.

  EVG850SOI-450mm

  • Introduction of the industry´s first Wafer Bonding System for 450 mm SOI semiconductor wafers: EVG®850SOI/450 mm.

  EVG_Spatenstich

  • EVG Headquarters Expansion to more than double the company´s production floor space in light of very strong order intake.
GeminiFB_EFEM


  • Launch of new flagship model with enhanced throughput and automation performance in the GEMINI®FB family of Fusion Wafer Bonding Systems.
  • Launch of new XT Frame equipment platform to boost High-Volume Manufacturing performance.

2012

  EVG850TBDB XT Frame Produktbild
  • Launch of the EVG®850TB/DB based on the XT Frame platform for High-Volume 3D-IC manufacturing.
  2012-EVG150
  • Next-generation, modular EVG®150 Automated Resist Processing Platform for high-volume spin / spray coating and developing applications unveiled.
  2012-EVG-Cleanroom
  • EV Group completes cleanroom expansion, opens new R&D labs and customer training center at corporate headquarters. 


2013

   2013-EVG120-gen-II
  • Launch of the flexible, next-generation EVG®120 Automated Resist Processing System for micro- and nano-electronics production.
  2013-EVG750_R2R
  • EVG introduces new, dedicated equipment series for nano structuring. New line-up includes the EVG®750 R2R, the industry's first Roll-to-Roll Thermal Nanoimprinting Lithography system.
  2013-EVG-Headquarters
  • EVG completes next expansion phase of corporate headquarters, opening an ultra-modern office building with representative entrance and reception area.
  2013-EVG720
  • The EVG®720 system leverages an innovative UV-NIL technology and EVG's material expertise to enable mass manufacturing of micro- and nanoscale structures.
  2013-PHABLE
  • The EVG®PHABLE™ exposure system allows cost-efficient volume production of photonic components through a unique contactless lithography mask-based approach.


2014

  2014_150XT
  • EVG®150XT: industry's first HVM resist processing system for mid-end and back-end interconnect applications.
    Patented NanoSpray™ conformal coating technology now available on the new EVG®150XT platform.
  2014_EVGChina
  • EV Group opens new subsidiary and China headquarters in Shanghai.
  2014_GEMINIFB_XT
  • GEMINI®FB XT: next-generation fusion wafer bonding platform, incorporating EVG's new SmartView® NT2 bond aligner, clears key barriers to 3D-IC / TSV HVM.
  2014_EVG580ComBond
  • EVG®580 ComBond®: new high-vacuum wafer bonding system enables electrically conductive and oxide-free covalent bonds of different substrate materials at room termperature
  2014_EVG7200
  • New SmartNIL™ large-area nanoimprint lithography (NIL) technology targets photonics, LED and bioengineered device production.
    Available on all EVG NIL platforms incl. new EVG®7200 UV-NIL system.

 

  • EVG establishes NIL Competence Center for photonic applications