History

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2000

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  2000-expansion
  • Founding of second wholly owned subsidiary in USA: EV Group Inc., Cranston, Rhode Island, for sales and customer support.
  • Headquarters building and manufacturing floor expansion, doubling of total floor (to ~ 6500 m²).
  • EV Group developed the first hot embossing system for emerging BioMEMS and microfluidics applications.

  GEMINI® Automated Production Wafer Bonding System

  • Fully-automated and integrated production systems were introduced. They cover all essential process steps for wafer bonding and lithography, providing a maximum integration and automation level: GEMINI® – The ultimate production wafer bonding system with integration of all wafer bonding process steps.

  HERCULES® Lithography Track System

  • HERCULES® – Fully automated and integrated lithography track system for coat/bake-align/expose - develop processes.

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2001

  EVG850_300mm
  • Celebration of the 20-year anniversary event.  
  • The first 300 mm automated SOI production bonder was designed and successfully installed. This tool integrates all the essential process steps to manufacture world-class, high-yield SOI bonded substrates.
  EVG®850DB Automated Debonding System
  • EV Group introduced the first temporary bonding and debonding systems which enable thin wafer processing in volume manufacturing and offer advanced capabilities for UltraThin® wafer processing.
 
  • EV Group entered the Chinese market with two new sales representations.
  • Introduction of company wide ERP Systems (Enterprise Resource Planning): SAP.
  • 70% headquarters building and manufacturing floor expansion (~to 11000 m²).


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2002

  IQ Aligner® Automated Mask Alignment System

  • The new 300 mm automated IQ Aligner®, which targets wafer level packaging and advanced MEMS applications, is another innovative highlight. It combines latest lithography and multiple reliable alignment techniques in one system.
  smart-view
  • EV Group introduced the first 300 mm Production Wafer Bonding System and 300 mm SmartView® Wafer-to-Wafer Bond Aligner.
    Several further 300 mm tool sets (resist processing systems, wafer and mask cleaning systems, wafer bonding systems) were completed and introduced to the market.

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2003

  EVG_jointech
  • Founding of EVG-Jointech Corp. in Chung-Li, Taiwan.
  EVG®810LT LowTemp® Plasma Activation System
  • EV Group announced LowTemp™ Plasma Bonding which is available on any of EV Group’s wafer bonding system to achieve highest bond strength at lowest annealing temperature.

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2004

  EVG®540 Automated Wafer Bonding System
  • Introduced Chip-to-Wafer bonding system for bonding a wafer with single devices.
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  • Large area spray coating system.
  • Dry film lamination system.
  • Launched new EVG®6200 Infinity Mask Aligner and NanoAlign® technology.
  • Developed the EVG®570PMI Nanoimprint Lithography (NIL) system for data storage applications.
  • Certification according to ISO 9001.

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2005

EVG®520IS Semi-automated Wafer Bonding System
  • Launch of new EVG®520IS Wafer Bonding System.
EVG_US
  • Automated equipment for NewMEMS technology.
  • Relocation and opening of new EVG North America Headquarters.
  • EV Group announced Realtek Technologies Pty Ltd. as exclusive agent for Australia.


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2006

  EVG150_NanoSpray
  • New NanoSpray technology from EVG achieves uniform resist layers on wafers with extreme topography.
  • EVG Celebrates its 25th company anniversary and 15 years supplying high volume MEMS manufacturing equipment.
  • EV Group offers first online shop provided by a semiconductor process equipment manufacturer at www.EVGTshop.com

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2007

  EVG®750 Automated Hot Embossing System
  • Manufacturing systems for hot embossing.
 
  • Manufacturing systems for double-side UV-NIL.
  • Coating systems for flexible organic displays. 
  • Expanded manufacturing area and worldwide cleanroom facilities.
  • Relocation milling center from Andorf to Headquarters.

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2008

  EVG®560 Automated Wafer Bonding System
  • EVG®560 Automated Wafer Bonding System up to 300 mm for 3D IC and TSV.
  evg_korea
  • Introduction of the ‘NT’ Series of aligners and measurement systems for 3D IC and other advanced semiconductor, MEMS and nanotechnology device manufacturing.
  • Founding of EV Group Korea Ltd.

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2009

  thumbnail-GEMINIFB
  • Launch of the GEMINI®FB - fully-automated production fusion bonding system with optical alignment for back side illuminated image sensors and 3D-IC.