History

historysite-new-historywall-headings2

1990

  1990_process-separation-principle
  • The process separation between wafer alignment and wafer bonding developed by EV Group revolutionized wafer bonding technology and has since become a worldwide industry standard.
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1992

1992_first-production-bonding-system
  • The first high performance production wafer bonding systems for automated volume production of MEMS was developed. This provided economical, automated production for micromachined components. The double side aligner and process separation are only two of the numerous innovations that contributed to the establishment of EV Group as a technology leader.

 

1994

1994_first-SOI-bonding-system
  • The first wholly owned subsidiary in USA: EV Group Inc., Phoenix, Arizona for sales and customer support was founded.
  • Installation of the first SOI wafer bonder, a fully automated tool for high-quality low cost SOI wafer production was implemented. This technology has proven to be critical for the production of components required for the latest generations of fast computers and state of the art products for telecommunications.

1997

1997_First-nanoimprinting-system        
  • Headquarters building was reconstructed and manufacturing and cleanroom area was doubled.
  • Founding of a wholly owned subsidiary in Yokohama, Japan: EV Group Japan KK.
  • EV Group entered the nanotechnology market with the development of the first nanoimprinting system.

 

1998

  OmniSpray® Coating System
  • EV Group developed the revolutionary OmniSpray® cavity coating technology for uniform photoresist layers on high topography surfaces.

1999

1999_SmartView
  • EV Group introduced the SmartView® wafer-to-wafer alignment system which incorporates a revolutionary face-to-face alignment technology for wafer-level packaging technologies and 3D interconnects for hyper-integration.