EV Group shares key highlights and developments at SEMICON Korea 2010:

At SEMICON Korea, the company highlights key products and solutions targeted at the Advanced Packaging & 3D Interconnect, Compound Semiconductor and Silicon-Based Power Devices, MEMS, Nanotechnology, and SOI markets.

EV Group presents the latest solutions for 3D Integration and TSV:
-  Lithography for 3D-ICs and CMOS image sensors
-  Wafer-to-wafer and chip-to-wafer bonding
-  Temporary bonding and de-bonding for thin wafer processing

The shift to smaller geometries along with more feature-dense packages adds a host of challenges, surrounding precision alignment capabilities, which can greatly impact device failure intolerance and, ultimately, yield and cost. To address increased demand for higher precision alignment accuracy, EV Group has introduced the new NT series, an already field-proven suite of mask aligners, wafer-to-wafer (W2W) bond aligners and measurement systems. The NT Series offers dramatically increased alignment accuracy—in the range of 1 µm down to 0.1 µm—for the manufacture of advanced MEMS, compound semiconductor, silicon-based power, 3D IC and nanotechnology devices—unlike anything else on the market.  Several new NT systems have already been installed at customer sites worldwide and passed the acceptance tests.

EVG Group has launched a new flagship solution for nanoimprint lithography (NIL):
Implementing a unique step and repeat imprinting approach, the new EVG770 GEN II NIL Stepper addresses large-area master fabrication for optical applications and replication of high-resolution features for nanooptics and nanoelectronics. As the first-of-its-kind UV-based NIL step and repeat system for micro optics, the EVG770 GEN II supports applications such as micro-lens molding for CMOS image sensors and wafer-level cameras. The system augments single-step processes, and enables the creation of lens masters for working stamp fabrication and subsequent full-wafer lens micro-molding.  Other applications utilizing high-resolution features include for example the manufacturing of waveguides, ring resonators and R&D for nanoelectronic applications (i.e., dual damascene and contact holes). The EVG770 GEN II step and repeat system supports hard and soft UV-NIL as well as micro-contact printing applications for wafer sizes ranging from 100 to 300 mm. The system supports semi- and fully-automated wafer and template transfer.

Leading Korean research center and foundry service provider selects EV Group’s GEMINI system for 3D MEMS manufacturing.
Reinforcing its leadership in the 3D integration and MEMS arena, EV Group has recently installed an automated GEMINI Wafer Bonding System at RFID/USN, Incheon (South Korea). The leading MEMS foundry that offers manufacturing services for companies to initiate production processes with capabilities to segue from R&D to high volume, will use the system for stacked 3D MEMS device development. This order represents a significant win for EVG, marking its first foray into the prestigious institute’s manufacturing line-up. EVG’s GEMINI platform is a field-proven, production manufacturing solution for high-volume wafer bonding applications for MEMS, 3D IC integration and advanced packaging, as well as compound semiconductor applications. Its modular design offers customers a highly flexible and extendible platform that enables customers the opportunity to incorporate pre-processing options such as cleaning and plasma activation modules, as well as additional bond chambers to augment throughput.  Additionally, this fully automated wafer bonding system integrates EVG’s SmartView® aligner, which yields precision alignment accuracy, as well as wafer handling expertise into one wafer bonding platform.