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EV Group (EVG) presents industry leading wafer processing equipment at SEMICON Korea 2012. Solutions for 3D Integration, Thin Wafer Handling and Advanced Packaging boosted by new XT Frame HVM equipment platform. 

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EVG’s new flexible, modular high-volume manufacturing equipment platform, dubbed the XT Frame, significantly increases tool functionality and throughput. Demo capabilities for the XT Frame are now available on the EVG850TB/DB Temporary Bonding and Debonding Systems, which can also accommodate EVG’s new EZR® (Edge Zone Release) and EZD® (Edge Zone Debond) modules to support ZoneBOND™ Temporary Bonding / Debonding technology.

Please visit our booth, or take a virtual tour and check the related information to find out more about EVG’s manufacturing solutions and major equipment categories:

  • Wafer Bonding Systems
  • Temporary Bonding / Debonding Systems
  • Mask / Bond Alignment Systems
  • Nanoimprint Lithography Systems
  • Metrology / Inspection Systems 
     


EVG Announcements at SEMICON Korea 2012:

EV Group boosts high-volume manufacturing performance across product lines with new XT Frame equipment platform
New flexible, modular equipment architecture increases tool functionality and throughput capabilities; Demo capabilities available on EVG850TB/DB systems supporting ZoneBOND™ technology
Read Press Release in English…
Read Press Release in Korean...


EVG Presentation at SEMICON Korea 2012:

5 SEMICON Korea 2012 | TechXPOT MEMS
Equipment Process Technology for Oxide-to-Oxide and Metal Bonding for High Volume Manufacturing of Miniaturized MEMS Devices for Mobile Applications
Markus Wimplinger, Corporate Technology Development & IP Director, EV Group
Tuesday, February 7, 10:30 – 12:30, Hall C, 3rd Fl., COEX