EV Group shares key highlights and developments at SEMICON Europa 2009

At SEMICON Europa, the company highlights key products and solutions targeted at the Advanced Packaging & 3D Interconnect, Compound Semiconductor and Silicon-Based Power Devices, MEMS, Nanotechnology, and SOI markets.

EV Group presents the latest solutions for 3D Integration and TSV:
-  Lithography for 3D-ICs and CMOS image sensors
-  Wafer-to-wafer and chip-to-wafer bonding
-  Temporary bonding and de-bonding for thin wafer processing

The shift to smaller geometries along with more feature-dense packages adds a host of challenges, surrounding precision alignment capabilities, which can greatly impact device failure intolerance and, ultimately, yield and cost. To address increased demand for higher precision alignment accuracy, EV Group has introduced the new NT series, an already field-proven suite of mask aligners, wafer-to-wafer (W2W) bond aligners and measurement systems. The NT Series offers dramatically increased alignment accuracy—in the range of 1 µm down to 0.1 µm—for the manufacture of advanced MEMS, compound semiconductor, silicon-based power, 3D IC and nanotechnology devices—unlike anything else on the market.  Several new NT systems have already been installed at customer sites worldwide and passed the acceptance tests.

EV Group reinforces leadership in Wafer-Level 3D integration, installing 300 mm GEMINI FB automated fusion wafer bonding systems at two leading CMOS image sensor manufacturing facilities in Asia.
EV Group, the company that pioneered optically aligned low-temperature fusion bonding, has completed the installation of two automated fusion bonding systems for 300-mm wafers at a leading semiconductor foundry and at a major consumer electronics manufacturer. The GEMINI FB clusters will be employed for the production of backside illuminated CMOS image sensors ranging from ultra-compact wafer-level cameras for mobile phones to larger form factor high-end image sensors. At the heart of the GEMINI FB platform is EVG’s SmartView technology – a proprietary, universal bond alignment system offering unmatched, sub-micron alignment accuracy for multiple wafer stacking in leading-edge 3D-integration applications. In addition to its dominant position in CMOS image sensor wafer processing equipment, EVG is a leading solutions provider for complementary process steps for the fabrication of micro lenses, thin-wafer handling and highly uniform coating and deep-etched trenches.

EVG Group launches a new flagship solution for nanoimprint lithography (NIL):
Implementing a unique step and repeat imprinting approach, the new EVG770 GEN II NIL Stepper addresses large-area master fabrication for optical applications and replication of high-resolution features for nanooptics and nanoelectronics.
As the first-of-its-kind UV-based NIL step and repeat system for micro optics, the EVG770 GEN II supports applications such as micro-lens molding for CMOS image sensors and wafer-level cameras. The system augments single-step processes, and enables the creation of lens masters for working stamp fabrication and subsequent full-wafer lens micro-molding.  Other applications utilizing high-resolution features include for example the manufacturing of waveguides, ring resonators and R&D for nanoelectronic applications (i.e., dual damascene and contact holes). The EVG770 GEN II step and repeat system supports hard and soft UV-NIL as well as micro-contact printing applications for wafer sizes ranging from 100 to 300 mm. The system supports semi- and fully-automated wafer and template transfer.

Please visit our presentations at SEMICON Europa 2009:

SEMI TECHNOLOGY ARENA
Test & Packaging Exhibitor Presentations
Thin Wafer Handling and Processing – Results achieved and Upcoming Tasks in the Field of 3D and TSV
Markus Wimplinger, Corporate Technology Development & IP Director, EV Group
Tuesday, October 6, 2009, 11:30pm – 11:45 hrs

SEMI TECHNOLOGY ARENA
MEMS/MST Exhibitor Presentations
Advanced MEMS Manufacturing
Otto Bobenstetter, Regional Sales Manager, EV Group
Wednesday, October 7, 2009, 14:15 – 14:30 hrs

ADVANCED PACKAGING MANUFACTURING CONFERENCE
Session II: 3D and Flipchip
Wafer-To-Wafer and Chip-to-Wafer Bonding for 3D-Interconnect Applications
Dr. Alfred Sigl, Product Manager, EV Group
Wednesday, October 7, 2009, 11:30 – 11:55 hrs

450mm IN EUROPE - QUO VADIS?
Getting 3D-IC Technology ready for 450 mm
Paul Lindner, Executive Technology Director, EV Group
Wednesday, October 7, 2009, 11:55 - 12:15 hrs