Join EVG at SEMICON China 2013!
EVG will be exhibiting its technology solutions portfolio at SEMICON China. EVG's industry-leading wafer processing equipment featured at the show addresses MEMS, High Brightness LED and CMOS Image Sensor manufacturing as well as Thin Wafer Handling requirements. Ahead of the show EVG announced the shipment of another fully-automated 300-mm integrated wafer bonding cluster from its GEMINI product family to a leading Chinese semiconductor foundry for 3D IC and Advanced Packaging volume production.
Read the Press Release in Chinese and English
Visit the EVG presentation:
Automotive Electronics Application, Development and MEMS Technology Forum
Wafer Bonding Technology for Vacuum Encapsulated MEMS Devices
Eric Pabo, Business Development Manager, EV Group
Wednesday, March 20, 15:50 - 16:20 hrs, Function Room 3, Kerry Hotel Pudong, Shanghai(Shangri-La Group)