EVG highlights key advancements at SEMICON West 2012
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EV GROUP UNVEILS NEXT-GENERATION TEMPORARY BONDING AND DEBONDING PLATFORM FOR HIGH-VOLUME 3D IC MANUFACTURING
EVG®850TB/DB system built on the company’s new XT Frame platform offers enhanced hardware, software and process control capabilities to enable two-fold increase in throughput to meet productivity and yield requirements of today’s 3D IC manufacturers
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EV GROUP’S GEMINI® AUTOMATED WAFER BONDING SYSTEM FIRST TO PASS EQUIPMENT MATURITY ASSESSMENT (EMA) BY SEMATECH
The GEMINI® system, installed at the College of Nanoscale Science and Engineering (CNSE) in Albany, New York, has become the first product to pass the systematic, rigorous assessment implemented within SEMATECH’s 3D Interconnect and Manufacturability program
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EVG Presentations at SEMICON West 2012
Enabling the Next Generation of HB LEDs – hosted by the SEMI LED Steering Committee
Nano-patterned Sapphire (NPSS): Making LEDs Brighter and Cheaper
Dr. Thomas Uhrmann, Business Development Manager, EV Group
Wednesday, July 12:10pm – 12:30pm, South Hall, Moscone Center
EVG presents solutions for PV cell and module manufacturing at Intersolar NORTH AMERICA 2012
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EVG provides equipment for PV cell and module manufacturing, including anti-reflective and anti-soiling coating, light trapping by nanoimpring lithography, thin-wafer processing, wafer bonding and photolithography.
EV GROUP AND BRISBANE MATERIALS TECHNOLOGY INTRODUCE BREAKTHROUGH ANTI-REFLECTIVE COATING SOLUTION FOR PV
Complete turnkey AR coating solution enables high-yield fabrication of AR coatings with industry-leading performance and cost to boost power output of photovoltaics.
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