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EV Group celebrates strong growth and unveils new manufacturing process solutions at SEMICON West 2013

EVG has achieved strong revenue growth, invested in new state-of-the-art cleanrooms and application labs and expanded its headcount  in the first half of 2013.  The company attributes this success to continuing demand for its flexible  process solutions  designed to address high-volume manufacturing (HVM) needs across multiple markets, including 3D-ICs, MEMS, power devices and compound semiconductors. EVG’s latest technology innovations that address these and other markets will be showcased  at SEMICON West  In addition to unveiling a series of new solutions, EVG also reports that it continues to expand its wafer processing services and process development consultation capabilities worldwide as part of the company’s long-term growth strategy.

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  EVG850-Automated-Production-Temporary-Bonding-and-Debonding-System-(XT-Frame)

EV GROUP ENHANCES WAFER DEBONDING SOLUTIONS PORTFOLIO WITH LOWTEMP™ ROOM-TEMPERATURE DEBONDING PLATFORM


EV Group (EVG) today introduced its LowTemp™ debonding platform, which features three different room-temperature wafer-debonding processes and an extended material supply chain.

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  EVG40NT-Automated-Metrology-System

EV PUSHES THE LIMITS ON 3D-IC MANUFACTURING FOR NEXT-GENERATION CMOS IMAGE SENSORS


EV Group (EVG) introduced the latest version of its EVG®40NT automated measurement system, which is designed to work in concert with the company's GEMINI® FB fusion wafer bonding system to support the manufacture of next-generation 3D-integrated CMOS image sensors.

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EVG Presentations at SEMICON West 2013

High Resolution In-line Metrology Module for High-Volume Temporary Bonding Applications
Markus Wimplinger,  Corporate Technology Development & IP Director, EV Group
SEMATECH Workshop on 3D Interconnect Metrology
Wednesday, July 10, 11:20 – 11:40 a.m. at San Francisco Marriott Marquis


From Sensor Fusion to System Fusion
Dr. Thorsten Matthias, Business Development Director, EV Group
SEMICON West TechXPOT North session “MEMS & Sensor Packaging for the Internet of Things”
Thursday, July 11, 12:10 – 12:30 p.m. at North Hall, Moscone Center

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EV Group showcases latest photovoltaic manufacturing advances at
Intersolar North America 2013:

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  intersolar

EVG offers complete solutions  for key PV cell and module manufacturing processes, including anti-reflective and anti-soiling coating, light trapping by nanoimprint lithography, thin-wafer processing, wafer bonding and photolithography equipment. The company is showcasing its latest technology innovations for improving performance and reducing costs of next-generation PV systems at Intersolar North America 2013.  

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