Semicon Europa 2013 Virtual Booth

HeaderImages_open13 

Join EVG at SEMICON Europa 2013 and PE 2013 Plastic Electronics Conference and Exhibition


Visit our booth #1425, hall 1 to discuss your semiconductor, MEMS and Nanotechnology as well as biomedical, optical and flexible electronics manufacturing needs.

sce13_web_0

Read our latest news:

EVG570_R2R

EV GROUP INTRODUCES ROLL-TO-ROLL NANOIMPRINT LITHOGRAPHY SYSTEM FOR BIOMEDICAL, OPTICAL AND FLEXIBLE ELECTRONICS APPLICATIONS


EV Group (EVG) today introduced the EVG®570R2R, the industry's first roll-to-roll thermal nanoimprint lithography (NIL) tool. Jointly developed with the Industrial Consortium on Nanoimprint (ICON), helmed by A*STAR's Institute of Materials Research and Engineering in Singapore, the EVG570R2R utilizes hot embossing to mass-produce films and surfaces with micro- and nanometer-scale structures for a variety of medical, consumer and industrial applications, including micro-fluidics, plastic electroinics and photovoltaics.

Download press release   Download press picture


EVG Presentations at SEMICON Europa 2013

Innovative Resist Processing for Advanced Packaging 
Dr. Antun Peic, Business Development Manager, EV Group (EVG)
Tuesday, October 8, 11:00 hrs, TechARENA 1´

Wafer Bonding Technology for Vacuum Encapsulation of MEMS Devices
Eric Pabo, Business Development Manager for MEMS, EV Group Inc.
Tuesday, October 8, 11:20 hrs, International MEMS/MST Industry Forum

Lab-to-Fab Micro Contact Printing for Flexible Electronics
Gerald Kreindl, Business Development Manager, EV Group (EVG)
Tuesday, October 8, 11:45 hrs, TechARENA 1

LowTemp™ Room-Temperature Debonding: Lifting Processing Restrictions
Dr. Thomas Uhrmann, Business Development Manager, EV Group (EVG)
Tuesday, October 8, 14:35 hrs, Advanced Packaging Conference

450 mm SOI Wafers - Development of 450 mm SOI Substrates, Related Technologies and Equipment
Uwe Kriebisch, Product Manager, EV Group (EVG)
Wednesday, October 9, 18:00 hrs, 450 mm Session

plastic electronics