Join EVG at SEMICON Europa 2013 and PE 2013 Plastic Electronics Conference and Exhibition
Visit our booth #1425, hall 1 to discuss your semiconductor, MEMS and Nanotechnology as well as biomedical, optical and flexible electronics manufacturing needs.
Read our latest news:
EV GROUP INTRODUCES ROLL-TO-ROLL NANOIMPRINT LITHOGRAPHY SYSTEM FOR BIOMEDICAL, OPTICAL AND FLEXIBLE ELECTRONICS APPLICATIONS
EV Group (EVG) today introduced the EVG®570R2R, the industry's first roll-to-roll thermal nanoimprint lithography (NIL) tool. Jointly developed with the Industrial Consortium on Nanoimprint (ICON), helmed by A*STAR's Institute of Materials Research and Engineering in Singapore, the EVG570R2R utilizes hot embossing to mass-produce films and surfaces with micro- and nanometer-scale structures for a variety of medical, consumer and industrial applications, including micro-fluidics, plastic electroinics and photovoltaics.
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EVG Presentations at SEMICON Europa 2013
Innovative Resist Processing for Advanced Packaging
Dr. Antun Peic, Business Development Manager, EV Group (EVG)
Tuesday, October 8, 11:00 hrs, TechARENA 1´
Wafer Bonding Technology for Vacuum Encapsulation of MEMS Devices
Eric Pabo, Business Development Manager for MEMS, EV Group Inc.
Tuesday, October 8, 11:20 hrs, International MEMS/MST Industry Forum
Lab-to-Fab Micro Contact Printing for Flexible Electronics
Gerald Kreindl, Business Development Manager, EV Group (EVG)
Tuesday, October 8, 11:45 hrs, TechARENA 1
LowTemp™ Room-Temperature Debonding: Lifting Processing Restrictions
Dr. Thomas Uhrmann, Business Development Manager, EV Group (EVG)
Tuesday, October 8, 14:35 hrs, Advanced Packaging Conference
450 mm SOI Wafers - Development of 450 mm SOI Substrates, Related Technologies and Equipment
Uwe Kriebisch, Product Manager, EV Group (EVG)
Wednesday, October 9, 18:00 hrs, 450 mm Session