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About EVG

EV Group (EVG) targets advanced packaging, compound semiconductor and silicon-based power devices, MEMS, nanotechnology and SOI markets with its industry-leading wafer-bonding, lithography/nanoimprint lithography(NIL), metrology, photoresist coating, cleaning and inspection equipment.

Vision/Mission

Awards & Certificates

Advertising

Events

History

News

Purchasing

Representatives & Industry Organizations

Environmental Policy

About

  • Vision/Mission
  • Awards & Certificates
  • Advertising
  • Events
  • History
  • News
  • Purchasing
  • Representatives & Industry Organizations
  • Environmental Policy

News and Events

University of Michigan's Lurie Nanofabrication Facility selects EV Group Wafer Bonding Systems

NILCom Members Present Solutions and Services for Commercialization of Nanoimprint Lithography (NIL)

more news ..

Innovations in Microsystems

SEMICON China 2010

more events ..

Promotional Links

Solutions for 3D Integration and TSV

EV Group Corporate Brochure

EV Group Product Range

See Also

Technical Papers

References

Webcast: 3D packaging

 
 
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  • About
    • Vision/Mission
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    • History
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      • Purchasing Conditions
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    • Representatives & Industry Organizations
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  • Products
    • Lithography
      • Mask Alignment Systems
        • EVG®620
        • EVG®620NT
        • EVG®6200∞
        • EVG®6200NT
        • IQ Aligner®
      • Resist Processing Systems
        • EVG®101
        • EVG®101LA
        • EVG®105
        • EVG®120
        • EVG®150
        • EVG®150N
      • Lithography Track Systems
        • Hercules®
      • Nanoimprint Lithography Systems (UV-NIL, µCP, HE)
        • EVG®620
        • EVG®6200∞
        • IQ Aligner®
        • EVG®770
        • EVG®510HE
        • EVG®520HE
        • EVG®750
      • Inspection Systems
        • EVG®40
        • EVG®40NT
    • Bonding
      • Wafer Bonding Systems
        • EVG®501
        • EVG®510
        • EVG®520IS
        • EVG®540
        • EVG®540C2W
        • EVG®560
      • Bond Alignment Systems
        • EVG®610
        • EVG®620
        • EVG®6200∞
        • SmartView®
        • SmartView®NT
      • Integrated Bonding Systems
        • Gemini®
        • GeminiFB®
      • SOI Bonding Systems
        • EVG®301
        • EVG®320
        • EVG®810LT
        • EVG®850
      • Temporary Bonding and Debonding Systems
        • EVG®805
        • EVG®850TB
        • EVG®850DB
        • EVG®820
      • Inspection Systems
        • EVG®20
        • EVG®40NT
    • Process Technology
  • Solutions
    • CMOS Image Sensors
      • Introduction
      • Backend Lithography
      • Glass Bonding
      • Oxide Bonding
    • High Brightness LEDs
      • Introduction
      • Layer Transfer
      • Imprint Lithography
      • Optical Lithography
      • Thin Wafer Handling
    • Lab-on-Chip
      • Introduction
      • Hot Embossing
      • Wafer Level Bonding
    • Logic / Memory
      • Introduction
      • Backend Lithography
      • Wafer Level Bonding
      • C2W Bonding
      • Thin Wafer Handling
    • MEMS Devices
      • Introduction
      • Lithography
      • First Level Packaging
    • SAW Devices
      • Introduction
      • Wafer Level Bonding
    • SOI Wafers
      • Introduction
      • Cleaning
      • Plasma Activation
      • Oxide Bonding
    • Wafer Level Optics
      • Introduction
      • Imprint Lithography
      • UV Bonding
  • Markets
    • Advanced Packaging, 3D Interconnect
    • Compound Semiconductor and Silicon-Based Power Devices
    • MEMS
    • Nanotechnology
    • SOI
  • Services
    • Process Technology
    • Customer Support
      • Field-Service On-site Visits
      • Technical Support Call Center
      • Spare Parts
      • Product Improvements
      • Training
        • Training Request
      • Extended Equipment Warranty
      • Preventive Maintenance Agreement
      • On-site Service Agreement
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