Referenzen

“We expect to see our volumes go up and now we have fully capable equipment to handle our volume requirements.”
Prof. Star Huang
CTO and Executive VP
Asia Pacific Microsystems, Inc., Taiwan

“The high integration level of the HERCULES system allows us to perform multiple microfabrication techniques on the same fully-automated machine. This reduces overall process time and results in a high throughput production output.”
Johannes Herrnsdorf
CEOT
HL-Planar Technik GmbH, Germany

“The customized configuration of EVG’s bonding system and versatility enables the application for SOI type manufacturing as well as specialized adhesive tape processing. Both applications can be run on the same system with a minimum of conversion expenditure.”
Martin Matschitsch/Helmut Schönherr
Infineon Technologies Austria AG

“EVG equipment has enabled us to achieve an unprecedented level of sophistication in our MEMS fabrication process.”
Prof. Martin A. Schmidt
Electrical Engineering and Computer Science Director
Microsystems Technology Laboratories
Massachusetts Institute of Technology

“The equipment from EVG is especially attractive to us as it supports various wafer sizes and materials without reconfiguration. Wafer bonding capabilities for eutectic, solder or anodic bonding offer us excellent process flexibility for our technology,”
Reuven Katraro
VP Engineering & Technology
Shellcase, Israel

“We trust EVG as our long-term partner. They support us with new developments and superior equipment technology for our SOI wafer production line.”
Dr. André Jaques Auberton-Hervé
President
SOITEC SA, France