Products

Aligners
EVG's superior aligner design with bottom side alignment allows for structure on both sides of a wafer, which is a unique technique developed by EVG in 1985. Based on flexibility and modularity, our aligners satisfy most critical demands in all areas of single and double-side photolithography and precision wafer alignment. EVG aligners can be customized for manual, R&D applications and high volume production with fully-automated handling.

Wafer Bonders
With more than ten years of experience in developing automated precision aligned wafer bonding equipment, EVG has set industry standards in all areas. Various wafer bonding techniques including anodic, silicon fusion, SOI, and thermo compression bonding are covered by our wafer bonders. We maintain a consistent bond chamber design on all bonders to allow for an easy migration of processes from manual to pilot-line and volume production. All wafer bonders are based on the unique process separation principle pioneered EVG in 1990, which carries out alignment and bonding in two steps for volume MEMS production.

Coaters/Developers
EVG's resist processing systems accept different resists and developer types with individually programmable processes. The modularity of our resist processing systems allows configurations of spin and spray coating, developing, and bake and chill modules. New areas of applications are supported with unique features like double-side coating, spray coating or square substrate coating capabilities.

Wafer Cleaners
In semiconductor processing, efficient cleaning and particle removal prior to critical process steps is important to assure maximum yield. Wafer cleaning is needed before photoresist coating, cleaning is necessary after a certain number of processes. The EVG300 series cleaning modules can perform any single wafer cleaning procedure and allow a combined deionized water rinse, megasonic cleaning, brush scrubbing for enhanced cleaning. Optional use of special chemistry gives the system the flexibility for many other cleaning applications.

Nanoimprint Lithography
Nanoimprinting is a technique to produce uniformly imprinted, ultra-fine structures. EVG's hot embossing systems are designed to apply high vacuum and high contact force conditions for precision imprinting. UV-Nanoimprint lithography is supported on EVG's systems using customized tooling.

Inspection Systems
Measurement and inspection process steps accompany all areas of microfabrication. As an integral part of EVG's wafer processing equipment, various types of measurement systems including double-side alignment accuracy measurement and infrared inspection for wafer bond qualification are available.

Integrated Systems
GEMINI and HERCULES are fully integrated and highly automated production systems for lithography and wafer bonding processes. A maximum level of automation and process integration opens the door to large-scale manufacturing and guarantees a proven transition of processes from R&D stage to production.

Customized Solutions
EV Group offers customized solutions for all markets to meet individual customer needs.