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NanoAlign
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NanoAlign Technology

EV Groupīs new NanoAlign Technology improves competitiveness of full-field lithography by providing the industryīs highest alignment accuracy and resolution at lowest cost of ownership. The new NanoAlign Technology features active run-out control and sub-100nm dynamic alignment resolution, complemented by UV-Nanoimprint (UV-NIL) capability.

EV Groupīs NanoAlign Technology is especially useful for packaging up to 300-mm wafers, UV-NIL, micro-contact printing, SAW devices and optical gratings. It is available on all EV Groupīs mask aligner platforms, including the all-new EVG6200 Infinity aligner which was launched during SEMICON West 2004.

The new EVG6200 Infinity aligner is designed for all MEMS, compound semiconductor, nanoimprint lithography and power-device applications as well as the wafer-bumping and chip-scale packaging markets.

   SEE ALSO:

NanoAlign Technology


LowTemp Plasma Bonding


Advanced-chip-to-wafer Technology (AC2W)


VLSI 10BEST 2006

 
   
   
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