LowTemp Plasma Bonding
EVG - the number one wafer bonding equipment manufacturer introduces another revolutionary bonding process: LowTemp plasma bonding. EVG has achieved a high level of know-how in low temperature bonding methods and tooling. This includes the newest addition to our product lines, plasma based, dry activated bonding. EVG's LowTemp Plasma bonding processes are applicable to silicon direct bonding for SOI and strained silicon bonding as well as applications in the fields of compound semiconductor bonding and MEMS device fabrication and packaging. Unique Features of EVG's LowTemp Plasma Bonding Systems: - Fastest kinetics of any bonding method
- Highest strength at lowest temperature
- SOI, MEMS, and advanced substrate bonding
- No liquids required
- Compatible with nearly all materials including CMOS
- Patented technology
- High throughput dry/plasma activated bonding on any EVG bonding system (ex-situ or in situ)
- Applicable to very fragile device wafers
- Cassette-to-cassette operation available
- Lowest cost of ownership
- Proven platform
- Particle neutral, metal free
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