EVG40 Top-to-Bottom Side Aligment Accuracy Measurement System

The EVG40 measurement system performs precision destruction-free top-to-bottom side alignment accuracy measurement of double-sided structured wafers. The EVG40 system surpasses the limitations of conventional double-view microscopes and infrared systems, which rely on a complicated and time consuming procedure to calibrate optical axis. EVG's system has no restrictions in depth of focus, accuracy or material usage by incorporating a 180° rotation in the measurement process. The EVG40 can accurately measure any type of substrate material up to 200 mm in size. Designed for flexibility, the fields of application for the EVG40 include: MEMS/MST, sensors, micro-optics, power devices, compound semiconductors, hybrid technology, multi-layers and all technologies that involve double-side lithography. EVG is the original inventor of the EVG40 (formally known as TBM-8) which was introduced to the market already in the early 90s.

Features:

• Non-destructive, visible light, self calibrating technology
• Repeatable top-to-bottom side alignment accuracy measurement
• Any wafer or substrate material up to 200 mm
• High power objectives from 5x to 50x
• Absolute accuracy < 0.5 µm with a statistical probability of 9937
• PC-based measurement system
• Manual to fully-automated versions

Basic Configurations:

EVG40 Standard

Basic Unit:

• Alignment Stage
• Optics

EVG40 Advanced

Basic Unit:

• Alignment Stage
• Optics

Advanced Features:

• Image Recognition System
• Quick Transparent Overlay
• Linewidth Measurement Mode

EVG40 Semi-Automated

Basic Unit:

• Alignment Stage
• Optics

Advanced Features:

• Image Recognition System
• Quick Transparent Overlay
• Linewidth Measurement Mode

Automation Features:

• Programmable Microscope Stage
• Rack
• Motorized Chuck Rotation
• Field-upgradeable to EVG40 AUTOMATED

EVG40 Fully-Automated

Basic Unit:

• Alignment Stage
• Optics

Advanced Features:

• Image Recognition System
• Quick Transparent Overlay
• Linewidth Measurement Mode

Automation Features:

• Programmable Microscope Stage
• Rack
• Motorized Chuck Rotation
• Robotic Autoload Cassette-to-Cassette

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