EVG Markets

Advanced Packaging, 3D Interconnect
New advanced chip packaging technologies such as wafer bumping, 3D interconnect and chip scale packaging aim to simplify production steps and package the IC at wafer level using a batch process to decrease the cost of packaging.

Compound Semiconductor and Silicon-Based Power Devices
Compound semiconductors are made from two or more different elements such as gallium arsenide (GaAs). Power devices are microelectronic components that are essential functional elements in electrical equipment.

MEMS
MEMS are intelligent, miniaturized 3D devices consisting of microelectronic components (integrated circuits) and micromechanical, optical, chemical, biochemical, or micro-optical components. MEMS technology is a rapidly emerging field with a high growth rate.

Nanotechnology
Nanoimprint Lithography (NIL) is one of the most promising and cost-effective new techniques for generating nanometer-scale-resolution patterns for a variety of commercial applications in BioMEMS, microfluidics, micro-optics, and patterned media.

SOI (Silicon on Insulator)
SOI technology uses layered silicon-insulator-silicon wafers in place of conventional silicon wafers as a means of producing smaller devices and reducing power consumption.