In modern electronic devices such as digital cameras, mobile phones, portable gaming consoles, laptops or netbooks, micro-optical systems are decisive interfaces between the real world and the microelectronics of the image sensor inside a camera module. At present, the general concept of a camera module assembly undergoes a transition from discrete assembly to wafer-level integration using well-established semiconductor technologies. Wafer-level cameras have already started to replace conventional modules due to smaller form factors and lower cost performance ratios.