Microfluidics
 Related Products

Lithographie

   

EVG®510HE Semi-automated Hot Embossing System

EV Group's EVG510HE is designed for hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity.

   

EVG®520HE Semi-automated Hot Embossing System

EV Group's EVG520HE is designed for hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity.

   

EVG®620 Automated UV Nanoimprint Lithography System

The EVG620 Automated NIL System allows for imprint processes with stamps to substrates ranging from small chip size pieces up to 150 mm in diameter.

   

EVG®6200∞ Automated UV Nanoimprint Lithography System

The EVG6200 Automated NIL System is designed for pattern creation in UV-curable materials from a prestructured stamp to a substrate.

   

EVG®750 Automated Hot Embossing System

EV Group's EVG750 is designed for hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity.

   

EVG®770 Automated NIL Stepper

EV Group's NIL Stepper is designed for step and repeat large area UV-Nanoimprint Lithography (UV-NIL) processes compatible for 100 mm up to 300 mm wafers.

   

IQ Aligner® Automated UV Nanoimprint Lithography System

The IQ Aligner automated double-side UV-NIL system allows for micromolding and nanoimprinting processes with stamps and wafers from 150 mm to 300mm diameter.

Bonding

   

EVG®520IS Semi-automated Wafer Bonding System

The EVG520IS Semi-automated Wafer Bonding System is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp™ plasma bonding.

   

EVG®540 Automated Wafer Bonding System

The EVG540 is an automated single-chamber production bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing in Wafer Level Packaging, 3D-Interconnect and MEMS applications.

   

EVG®560 Automated Wafer Bonding System

The EVG560 accepts up to four bond chambers with various bond chamber configuration options for all bonding processes and wafers up to 300 mm.

   

EVG®820 Lamination System

The EVG820 lamination station is used for automated, stress-free lamination of any kind of dry adhesive film onto the carrier wafer.

   

Bonding

   

Lithographie