Go to the main navigation
Go to content

High Brightness LEDs
Related Products

Lithographie

EVG®101 Advanced Resist Processing System

The EVG101 series perform R&D type processes on a single chamber design, which is fully compatible with our automated systems.

EVG®120 Automated Resist Processing System

The EVG120 Automated Resist Processing System is an economical tool for quality spin coating and develop processes, especially for standard photoresist applications.

EVG®620 Automated Mask Alignment System

Mask Alignment System designed for optical double-side lithography. Volume production types and manual R&D systems are available.

EVG®770 Automated NIL Stepper

EV Group's NIL Stepper is designed for step and repeat large area UV-Nanoimprint Lithography (UV-NIL) processes compatible for 100 mm up to 300 mm wafers.

Hercules® Lithography Track System

The Hercules is a unique platform with spin coat, bake, chill, align/expose and develop modules, all arranged in one production system.

IQ Aligner® Automated UV-NIL, µ-CP System

The IQ Aligner automated double-side UV-NIL system allows for micromolding and nanoimprinting processes with stamps and wafers from 150 mm to 300mm diameter.

Bonding

EVG®560 Automated Wafer Bonding System

The EVG560 accepts up to four bond chambers with various bond chamber configuration options for all bonding processes and wafers up to 300 mm.

EVG®805 Semi-automated Debonding System

The EVG805 is a semi-automated system for debonding thin wafers from sapphire, quartz or silicon carriers.

EVG®810LT LowTemp™ Plasma Activation System

The EVG810LT LowTemp™ plasma activation system is a single chamber, stand-alone unit for SOI, MEMS, compound semiconductors and advanced substrate bonding.

EVG®850 Automated Production Bonding System for SOI

The EVG850 is designed to fulfill a wide range of fusion wafer bonding applications, with main focus on SOI substrates manufacturing. The EVG850 is the only production bonding system built to operate in high throughput, high-yield environments.

EVG®850DB Automated Debonding System

The EVG850DB Automated Debonder is designed for automated debonding of device wafer from the carrier substrate.

EVG®850TB Automated Temporary Bonding System

The EVG850 bonds compound semiconductor wafers to sapphire, quartz or silicon carriers by use of dry film, spin-on adhesives, or wax.

Gemini® Automated Production Wafer Bonding System

EV Group's GEMINI provides a fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding.

Lösungen

News und Events

EV Group bringt neue Generation des EVG120 Automated Resist Processing Systems auf den Markt

EV Group liefert 300mm Wafer Bonding System an führende chinesische Halbleiter-Foundry

weitere News ..

sensors expo & conference 2013

weitere Events ..

198x350_hr-banner

See Also

Related Products

EV Group Introduces Industry's First Fully Automated Wafer Bonding System for HB-LED Manufacturing

Verbindungshalbleiter und Leistungsbauteile aus Silizium

Nanotechnologie

Technische Publikationen

EV Group Corporate Video

3D InCites reports on EVG Headquarters expansion and technology developments

EV Group HR Video

References

Semiconductor 3-D Equipment and Materials Consortium
EVG is member of the EMC-3D consortium, created for the development of cost-effective 3D TSV (Through-Silicon-Via) interconnect