LowTemp™ Multilayer Adhesive Debonding

EVG® LowTemp™ debonding technology includes room-temperature multilayer adhesive debonding. This means that the separation of the carrier and device wafer is initiated by mechanical means. Several temporary bonding adhesives are available that feature this mechanical debond capability. Multilayer adhesive coatings are mandatory for mechanical debonding. The adhesive layer embeds and supports the thin semiconductor device wafer, while another functional layer sets the adhesion and debonding process.

EVG Multilayer Adhesive Debonding Features:
Fusion wafer bonding brings several advantages:

  • Room temperature debonding by mechanical separation
  • Universal equipment technology enabling all common mechanical debond adhesives and techniques
  • Full control and monitoring of the mechanical debonding process

Key process steps schematic:

Mechanical-Debond_small