IQ Aligner® NT Automated Mask Alignment System

Optimized for contactless proximity processing at highest throughput. Most accurate print gap control and unmatched uptime are fully addressing HVM requirements.

EVG IQ Aligner NT

 

  • Substrate / Wafer parameters:
    Size: 200 mm, 300 mm; Thickness: 0.1 - 10 mm
  • Mask parameters:
    Size: 9" x 9"or 14" x 14"; Thickness: < 0.19"
  • General system configuration:
    Semi-automated and/or automated wafer loading
  • Throughput:
    First Print: up to 200 wph
    Top Side Alignment: up to 160 wph
    Back Side Alignment: up to 160 wph
  • Alignment accuracy:
    Topside alignment: ± 0.25 µm 3σ
    Backside alignment: ± 0.5 µm 3σ
    Full Clearfield Mask Movement: ± 0.5 µm 3σ
    IR alignment: Option / substrate dependent
  • Exposure:
    Modes: Proximity, soft-, hard contact
    Resolution in proximity: ≥ 3µm
    Broad band intensity: ≥ 120 mW/cm²
    i-line intensity: ≥ 65 mW/cm²
    Light uniformity: ± 4% / 300 mm 
  • Handling system: 3 automated 200 / 300 mm cassette / FOUP load ports, also supports manual wafer loading 
  • Automatic mask loading: Option
  • SECS/GEM, GEM 300: Option