EVG®6200∞ Automated Mask Alignment System

Optimized for highest throughput, highest mean time between failures and most accurate print gap settings.

 

Brochures
Please click the picture to download the brochure in PDF format


EVG Mask Aligner Short Brochure.pdf

Technical Papers
Please click the titles to download the full papers in PDF format



Advances in processing of compound semiconductor substrates
Abstract: Compound semiconductor materials such as GaAs and InP have distinct advantages over the more traditional silicon, chief of which is the greater electron mobility within the substrate, allowing greater use in low-noise, high gain applications. However, the advantages of these materials come with corresponding disadvantages...



An ultra-thick positive photoresist for advanced electroplating applications
Abstract: Flip chip packaging has been adopted for microprocessors and high-performance logic for performance reasons. Over time, flip chip is increasingly being adopted by lower transistor count devices for cost savings as flip chip packaging reaches cost parity with wire bonding in many applications...



Ultra-thick lithography for advanced packaging and MEMS
Abstract: An ever increasing need exists for thick resist layers in the processing of MEMS and for advanced packaging.  Applications in the MEMS field include bulk micromachining, surface micromachining, and the actual creating of active device structures... 



Wafer level packaging on Cu/low-K, high density back-end integrated circuits
Abstract: The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. Wafer level packaging is a promising technology to meet future demands of increase performance for advanced integrated circuits with tighter pitch (higher feature density) higher I/O counts and Cu metallization with low-k dielectric layers...