For fully automated and integrated coating, mask alignment, exposure
BrochuresPlease click the picture to download the brochure in PDF formatEVG100 Series Short Brochure.pdfTechnical Papers
Please click the titles to download the full papers in PDF formatAn ultra-thick positive photoresist for advanced electroplating applicationsAbstract: Flip chip packaging has been adopted for microprocessors and high-performance logic for performance reasons. Over time, flip chip is increasingly being adopted by lower transistor count devices for cost savings as flip chip packaging reaches cost parity with wire bonding in many applications...Lithography technologies for wafer-level packagingAbstract: The roadmap for transistor scaling predicts further increase of circuit complexity, which comes along with higher pin count densities (pins per unit area) and therefore smaller feature sizes. With respect to the continuous reduction in IC feature size and with increased demand for better performance attended with the simultaneous increase of I/O, wafer-level packaging (WLP) and fine-pitch wafer bumping have become a very interesting solution for IC packaging...
Advanced Packaging und 3D-IC Markt verhelfen Automated 300-mm Polymer Adhesive Bonding Systemen von EV-Group zu starkem Wachstum
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